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XCVC1902-2MSIVSVA2197

Xilinx

XCVC1902-2MSIVSVA2197 by Xilinx

XCVC1902-2MSIVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 110 °C, with supply voltage range of 0.775V to 0.825V. This GRID ARRAY IC is ideal for applications requiring high performance and reliability in compact designs.

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Vyrian

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AZTECH Wire

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One Stop Electronics

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Ampacity Inc.

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Modulus Dynamics

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Microchip USA

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Qasali Group International

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Overview

Experience the cutting-edge technology of the XCVC1902-2MSIVSVA2197 by Xilinx, a top-of-the-line Other Function uPs,uCs & Peripheral ICs. With a focus on quality and innovation, Xilinx delivers top-notch products that exceed expectations. This versatile device offers endless possibilities for applications in various industries, providing customers with unmatched value, benefits, and advantages. Trust Xilinx to bring you the best in performance and reliability, setting new standards in the field of microprocessor circuits. Elevate your projects with the XCVC1902-2MSIVSVA2197 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability makes the product easy to integrate into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.825 V

The high maximum supply voltage allows for reliable operation even in systems with fluctuating power sources.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards, optimizing space utilization.

No. of Terminals: 2197

The large number of terminals allows for versatile connectivity options and integration with a wide range of system configurations.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array and heat sink/slug package style helps in dissipating heat effectively, ensuring optimal performance under high operating temperatures.

Minimum Supply Voltage: 0.775 V

The low minimum supply voltage ensures power efficiency and compatibility with various power sources.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature demonstrates the product's ability to withstand harsh environmental conditions and prolonged usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies soldering and assembly processes, making the product easy to handle during integration.

Maximum Seated Height: 4 mm

The low maximum seated height allows for compact design options and facilitates efficient airflow for cooling purposes.

Width: 45 mm

The standard width dimension enables compatibility with industry-standard mounting configurations and facilitates easy integration into existing systems.

Length: 45 mm

The standard length dimension provides flexibility in placement options and compatibility with standard mounting layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities and enables complex functionalities in the system.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form allows for reliable and secure connections with other components, ensuring stable performance under various operating conditions.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage specification indicates the expected operating voltage, ensuring compatibility with standard power sources and power management circuits.

Terminal Pitch: 0.92 mm

The small terminal pitch facilitates high-density mounting and enables compact design layouts, making the product suitable for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVC1902-2MSIVSVA2197 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B2197

JESD-609 Code:

e1

Length:

45 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA2197,47X47,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

45 mm

Peripheral IC Type:

Trade Compliance

XCVC1902-2MSIVSVA2197 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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