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XC3S4000-4FGG676I

Xilinx

XC3S4000-4FGG676I by Xilinx

XC3S4000-4FGG676I by Xilinx is a CMOS FPGA with 62208 logic cells and 6912 CLBs. It operates at a max clock frequency of 630 MHz and is commonly used in applications requiring high-speed data processing.

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$265.805

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Overview

Discover the power of the XC3S4000-4FGG676I by Xilinx, a top-of-the-line Field Programmable Gate Array (FPGA). With its advanced CMOS technology and 62208 logic cells, this FPGA ensures superior performance and reliability. Whether you're working on complex digital designs or high-speed data processing, the XC3S4000-4FGG676I delivers unmatched efficiency and flexibility. Its 6912 CLBs and 4000000 equivalent gates provide endless possibilities for customization. Plus, with a maximum clock frequency of 630 MHz, this FPGA is perfect for time-sensitive applications. Experience the value and benefits that Xilinx brings to the table with this exceptional product. Upgrade your projects today and unlock a world of innovation with the XC3S4000-4FGG676I!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this FPGA lightweight and durable, ideal for applications that require portability and reliability.

No. of Logic Cells: 62208

With a high number of logic cells, this FPGA offers ample resources for designing complex and versatile digital circuits, making it suitable for advanced applications in the fields of telecommunications, aerospace, and data processing.

Surface Mount: YES

Being surface mountable, this FPGA enables efficient and convenient integration onto circuit boards, simplifying assembly processes and ensuring reliable connections.

Maximum Supply Voltage: 1.26 V

With a relatively low maximum supply voltage, this FPGA operates with lower power consumption, resulting in reduced heat dissipation and enhanced energy efficiency.

No. of CLBs: 6912

The large number of configurable logic blocks (CLBs) in this FPGA allows for a high degree of customization and flexibility, enabling the implementation of complex digital functions.

Technology Used: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this FPGA offers low power consumption, high noise immunity, and improved performance, making it well-suited for various applications requiring reliable digital logic operations.

No. of Inputs: 489

With a generous number of input pins, this FPGA accommodates a wide range of external signals, enabling versatile interfacing capabilities and supporting intricate designs.

Package Shape: SQUARE

The square package shape offers a compact footprint, optimizing space utilization on circuit boards and allowing for efficient integration into electronic systems.

Form Of Terminal: BALL

Employing ball terminals, this FPGA provides reliable electrical connections and facilitates assembly processes, making it suitable for automated production.

No. of Equivalent Gates: 4000000

The vast number of equivalent gates translates into high logic density, enabling the implementation of complex digital circuits and supporting advanced functionalities.

Nominal Supply Voltage (V): 1.2

With a stable and standardized nominal supply voltage, this FPGA ensures compatibility and interoperability with a wide range of electronic components, simplifying system integration.

Power Supplies (V): 1.2, 1.2/3.3, 2.5

The availability of multiple power supply options provides flexibility in designing and operating the FPGA, allowing for compatibility with various voltage requirements of surrounding circuitry.

No. of Terminals: 676

The FPGA's abundant number of terminals enables efficient connectivity, supporting diverse input and output configurations and facilitating the implementation of complex circuitry.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this product allows users to reconfigure the internal circuitry according to their specific application requirements, offering unparalleled flexibility and adaptability.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure and reliable electrical connections, preventing signal interference and enhancing overall system performance, making it desirable for applications demanding high signal integrity.

Minimum Supply Voltage: 1.14 V

With a low minimum supply voltage, this FPGA can operate efficiently even in low-power scenarios, making it suitable for battery-powered devices and energy-conscious applications.

Pitch Of Terminal: 1 mm

The small terminal pitch allows for high-density routing and compact integration, enabling the construction of intricate digital circuits within limited space.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The short maximum combinatorial delay of a configurable logic block (CLB) ensures quick signal processing and minimizes propagation delays, enabling high-speed operation and efficient system performance.

Organization: 6912 CLBS, 4000000 GATES

With a well-organized structure consisting of 6,912 configurable logic blocks (CLBs) and 4,000,000 gates, this FPGA offers a balanced combination of configurability and raw processing power, making it a versatile solution for various applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The utilization of tin silver copper (TSC) as the terminal finishing enhances both electrical conductivity and corrosion resistance, ensuring reliable signal transmission and long-term product durability.

Position Of Terminal: BOTTOM

The position of the terminals at the bottom of the FPGA simplifies the routing of signals and facilitates efficient PCB layout, contributing to streamlined system design and assembly.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this FPGA can withstand moderate moisture exposure during manufacturing and storage processes, ensuring product reliability and minimizing the risk of moisture-related failures.

Maximum Seated Height: 2.6 mm

The relatively low maximum seated height allows for compact system designs, enabling the integration of the FPGA into space-constrained environments without compromising overall system dimensions.

Width: 27 mm

The FPGA's width of 27 mm offers a compact form factor, facilitating seamless integration into circuit board layouts and ensuring efficient use of available space.

Maximum Clock Frequency: 630 MHz

With a high maximum clock frequency, this FPGA can process signals rapidly and support high-speed data transfers, making it well-suited for demanding applications that require real-time processing and fast response times.

No. of Outputs: 489

With a generous number of output pins, this FPGA can drive multiple external devices and support complex signal routing, enabling the implementation of versatile digital applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a peak reflow temperature for up to 30 seconds allows for reliable surface mount soldering, ensuring secure connections and robust board-level assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures effective solder melting and reliable solder joint formation during surface mount assembly processes, ensuring excellent mechanical and electrical connections.

Length: 27 mm

The product's length of 27 mm contributes to its compact footprint, enabling flexible and space-efficient integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S4000-4FGG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

62208

No. of Inputs:

489

No. of Outputs:

489

No. of CLBs:

6912

No. of Equivalent Gates:

4000000

Maximum Clock Frequency:

630 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

6912 CLBS, 4000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S4000-4FGG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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