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XC3S1400AN-4FGG676C

Xilinx

XC3S1400AN-4FGG676C by Xilinx

Xilinx XC3S1400AN-4FGG676C FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. Ideal for applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Package style: grid array, surface mountable in plastic/epoxy material.

Median Price

$236.585

Lifecycle Status

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Mouser Electronics

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Digiode

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AZTECH Wire

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Modulus Dynamics

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Vigor

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Texas Native Microelectronics

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Microchip USA

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Kenton Components

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Ampacity Inc.

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Overview

Unlock limitless possibilities with the Xilinx XC3S1400AN-4FGG676C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts 25344 logic cells and 1400000 equivalent gates, making it ideal for a wide range of applications. From telecommunications to industrial automation, this FPGA offers unparalleled flexibility and performance. Experience the power of cutting-edge technology with the XC3S1400AN-4FGG676C and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Supply Voltage: 1.26 V

With a relatively low maximum supply voltage, the product is energy efficient and can help in reducing power consumption.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for a wide range of applications.

Maximum Clock Frequency: 667 MHz

The high clock frequency allows for faster data processing and improved performance.

No. of Outputs: 408

With a large number of outputs, the product can handle complex logic functions and support multiple tasks simultaneously.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1400AN-4FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

25344

No. of Inputs:

502

No. of Outputs:

408

No. of CLBs:

2816

No. of Equivalent Gates:

1400000

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2816 CLBS, 1400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S1400AN-4FGG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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