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XC3S1000-5FG320C

Xilinx

XC3S1000-5FG320C by Xilinx

Xilinx XC3S1000-5FG320C FPGA offers 17280 logic cells, 1920 CLBs, and 1M equivalent gates. With a max clock frequency of 725 MHz, it is ideal for high-speed applications like telecommunications and signal processing. Operating temperature range from 0 to 85°C makes it versatile for various environments.

Median Price

$171.600

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Nova Conductors

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AZTECH Wire

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Kenton Components

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Overview

Unlock limitless possibilities with the Xilinx XC3S1000-5FG320C! This cutting-edge Field Programmable Gate Array boasts 17280 logic cells and 1920 CLBs, providing unmatched flexibility and performance for a wide range of applications. With Xilinx's reputation for quality and innovation, you can trust that this FPGA delivers exceptional reliability and efficiency. Whether you're designing aerospace systems, automotive electronics, or industrial control solutions, the XC3S1000-5FG320C offers unparalleled value and benefits, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 17280

With a high number of logic cells, this FPGA offers a high level of programmability and flexibility for complex designs.

Surface Mount: YES

The surface mount feature allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 1920

The large number of Configurable Logic Blocks (CLBs) provides ample resources for implementing versatile functions within the FPGA design.

Technology Used: CMOS

The use of CMOS technology ensures fast operation and low power consumption, making it suitable for high-performance applications.

No. of Inputs: 221

The abundance of input pins allows for robust connectivity and input/output options in the FPGA design.

Package Shape: SQUARE

The square package shape facilitates easier handling and integration into square or rectangular PCB layouts.

Form Of Terminal: BALL

The ball terminal design simplifies the soldering process, ensuring reliable connections and easy rework if needed.

No. of Equivalent Gates: 1000000

With a high number of equivalent gates, this FPGA can support complex logic functions and algorithms efficiently.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage ensures compatibility with standard power sources and stability in operation.

Power Supplies (V): 1.2,1.2/3.3,2.5

The multiple power supply options offer flexibility in voltage requirements, catering to a variety of system configurations.

No. of Terminals: 320

The abundance of terminals provides ample connectivity options, enabling versatile interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA allows for customization and reconfiguration, offering flexibility in design iterations.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy PCB layout and alignment during assembly, ensuring proper functionality.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for operation in low-power scenarios, enhancing energy efficiency and battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments and extended operating conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminal spacing enables compact design layouts and high-density integration.

Maximum Combinatorial Delay of a CLB: 0.53 ns

The low combinatorial delay ensures fast signal propagation and minimal latency in logic operations.

Organization: 1920 CLBS, 1000000 GATES

The organized structure of CLBs and gates provides a clear layout for designing and implementing complex logic functions effectively.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance in cold environments or during initial power-up.

Finishing Of Terminal Used: TIN LEAD

The use of tin-lead finishing on terminals ensures good solderability and reliability in electronic connections.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies PCB layout and routing, optimizing signal paths and reducing interference.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate sensitivity to moisture, requiring appropriate handling during storage and assembly processes.

Maximum Seated Height: 2 mm

The low seated height profile allows for slim and compact system designs, particularly in space-constrained applications.

Width: 19 mm

The width dimension provides a compact form factor, enabling efficient use of PCB real estate and allowing for high-density integration.

Maximum Clock Frequency: 725 MHz

The high maximum clock frequency supports rapid data processing and real-time operations in high-speed applications.

No. of Outputs: 221

The ample output pins allow for versatile signal routing and connectivity options in the FPGA design.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper solder reflow and component reliability during manufacturing processes.

Peak Reflow Temperature °C: 225

The high peak reflow temperature tolerance enables robust soldering processes, ensuring strong and reliable connections.

Length: 19 mm

The length dimension offers a compact footprint, contributing to space-saving designs and efficient utilization of PCB area.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1000-5FG320C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

17280

No. of Inputs:

221

No. of Outputs:

221

No. of CLBs:

1920

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

725 MHz

CLB Maximum Delay:

0.53 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1920 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA320,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

320

Standards

JESD-30 Code:

S-PBGA-B320

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S1000-5FG320C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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