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XMS432P401RIZXHR

Texas Instruments

XMS432P401RIZXHR by Texas Instruments

XMS432P401RIZXHR by Texas Instruments is a 32-bit microcontroller with 262144 ROM words, 65536 RAM bytes, and 18-Ch 14-Bit ADC channels. It operates at a max clock frequency of 48 MHz and features peripherals like DMA, RTC, and timers. Ideal for industrial applications requiring high-speed processing and multiple connectivity options such as I2C, SPI, and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,884 parts In-Stock

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6,884

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Digiode

USA . 2,595 parts In-Stock

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2,595

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Distributors (Availability)

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One Stop Electronics

USA . 525 parts In-Stock

1+ parts

$14.000

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525

$14.000

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AZTECH Wire

Italy . 871 parts In-Stock

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$18.512

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871

$18.512

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Parana Technologies

USA . 992 parts In-Stock

1+ parts

$44.753

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992

$44.753

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DigiPath Technology Company

USA . 2,299 parts In-Stock

1+ parts

$49.278

100+ parts

$45.336

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2,299

$49.278

$45.336

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ChromeModa Solutions

Germany . 1,018 parts In-Stock

1+ parts

$50.284

100+ parts

$41.233

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1,018

$50.284

$41.233

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$50.284

100+ parts

$47.770

1k+ parts

$45.256

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188

$50.284

$47.770

$45.256

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Corphita

USA . 4,838 parts In-Stock

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Microchip USA

USA . 169 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the XMS432P401RIZXHR microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products designed to meet the needs of various applications. With its advanced features and reliable performance, this microcontroller offers unmatched value to customers. Whether you are working on a project that requires precise data acquisition or need a solution for real-time control systems, the XMS432P401RIZXHR is the perfect choice. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.7 V

Allows for a wide range of power supply options, increasing flexibility in design and operation.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance for demanding applications.

No. of Terminals: 80

Ample number of terminals allow for connectivity with peripherals and external components, expanding functionality.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, facilitating sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enhance data transfer efficiency, reducing CPU overhead and improving system performance.

Maximum Clock Frequency: 48 MHz

High clock frequency supports fast and responsive operation, suitable for real-time processing requirements.

RAM Bytes: 65536

Generous amount of RAM allows for efficient data storage and manipulation, enabling complex algorithms and multitasking.

Technical Specifications

Microcontrollers XMS432P401RIZXHR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

Length:

5 mm

No. of I/O Lines:

64

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI(7), SPI(2), UART

Peripherals:

COMPARATOR(2), DMA(8), RTC, TIMER(6), WDT

Analog To Digital Convertors:

18-Ch 14-Bit

Trade Compliance

XMS432P401RIZXHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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