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XMS430F5528IZQE

Texas Instruments

XMS430F5528IZQE by Texas Instruments

Texas Instruments XMS430F5528IZQE microcontroller features 16-bit architecture, 80 terminals, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications, it offers ADC and DMA channels, flash ROM programmability, and supports up to 33 I/O lines.

Median Price

$61.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 6 parts In-Stock

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$61.250

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6

$61.250

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Vyrian

USA . 7,931 parts In-Stock

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Digiode

USA . 889 parts In-Stock

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889

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 215 parts In-Stock

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$15.425

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215

$15.425

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Parana Technologies

USA . 729 parts In-Stock

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$23.325

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$23.966

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729

$23.325

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ChromeModa Solutions

Germany . 6,411 parts In-Stock

1+ parts

$26.208

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$21.491

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6,411

$26.208

$21.491

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IDEA Electronic Components Group

UK . 2,268 parts In-Stock

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$26.208

100+ parts

$24.898

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$23.587

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2,268

$26.208

$24.898

$23.587

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One Stop Electronics

USA . 1,516 parts In-Stock

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$29.000

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1,516

$29.000

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Corphita

USA . 3,425 parts In-Stock

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3,425

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DigiPath Technology Company

USA . 926 parts In-Stock

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$23.629

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926

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$23.629

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Overview

Unleash the power of innovation with the XMS430F5528IZQE microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. Perfect for a wide range of applications, this microcontroller offers exceptional value with its advanced features and capabilities. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller provides the performance and flexibility you need to bring your ideas to life. Trust Texas Instruments to transform your concepts into reality with the XMS430F5528IZQE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input.

Bit Size: 16

Offers a good balance between performance and cost.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures may be encountered.

ADC Channels: YES

Enables analog-to-digital conversion functionality.

DMA Channels: YES

Supports direct memory access for efficient data transfers.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and control.

ROM Programmability: FLASH

Allows for reprogrammability of the read-only memory.

Speed: 25 rpm

Provides sufficient processing speed for various applications.

No. of I/O Lines: 33

Offers a good number of input/output lines for connectivity.

Technical Specifications

Microcontrollers XMS430F5528IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 1.8V MINIMAL SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

Length:

12 mm

No. of I/O Lines:

33

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XMS430F5528IZQE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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