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XMS430AFE253IPWR

Texas Instruments

XMS430AFE253IPWR by Texas Instruments

XMS430AFE253IPWR by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 16 MHz. Ideal for industrial applications, it features Flash ROM programmability, PWM channels, and operates b/w -40°C to 85°C.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 4,051 parts In-Stock

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Digiode

USA . 698 parts In-Stock

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698

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AZTECH Wire

Italy . 364 parts In-Stock

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$14.384

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364

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One Stop Electronics

USA . 857 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,381 parts In-Stock

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$35.478

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DigiPath Technology Company

USA . 2,336 parts In-Stock

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$39.066

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$35.940

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IDEA Electronic Components Group

UK . 706 parts In-Stock

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$39.863

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$37.870

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$35.877

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706

$39.863

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ChromeModa Solutions

Germany . 292 parts In-Stock

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$39.863

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$32.688

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Corphita

USA . 3,524 parts In-Stock

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Overview

Unleash the power of innovation with the XMS430AFE253IPWR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments brings you a cutting-edge solution for your electronic design needs. Whether you're working on IoT devices, consumer electronics, or industrial applications, this microcontroller offers unmatched quality and reliability. With its compact size, high clock frequency, and flash programmability, the XMS430AFE253IPWR delivers exceptional performance while minimizing power consumption. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient soldering onto circuit boards, making the installation process simpler.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

Compact and space-saving design for efficient use of board space in electronic devices.

Bit Size: 16

Offers a good balance between processing power and complexity for various tasks and applications.

No. of Terminals: 24

Provides ample connection points for interfacing with other components and peripherals.

Minimum Supply Voltage: 3.3 V

Can operate at low voltages, conserving energy and reducing power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments with harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold environments without performance degradation.

Terminal Position: DUAL

Provides flexibility in the PCB layout and allows for efficient signal routing.

Maximum Seated Height: 1.2 mm

Low profile design for compact and space-constrained applications.

Width: 4.4 mm

Small form factor for integration into tight spaces or small electronic devices.

Maximum Clock Frequency: 16 MHz

High clock speed for rapid data processing and execution of instructions.

Length: 7.8 mm

Compact size for integration into small electronic devices or embedded systems.

Temperature Grade: INDUSTRIAL

Built to withstand rugged industrial environments and harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and streamlined data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections for improved reliability.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) for precise control of output signals.

ROM Programmability: FLASH

Allows for easy reprogramming of the microcontroller's memory, offering flexibility in firmware updates.

Terminal Pitch: 0.65 mm

Fine pitch terminals for high-density mounting on PCBs, enabling compact and space-efficient designs.

Speed: 12 rpm

Capable of running at a speed of 12 revolutions per minute for controlled motion applications.

No. of I/O Lines: 11

Sufficient number of input/output lines for interfacing with external sensors, switches, and peripherals.

Technical Specifications

Microcontrollers XMS430AFE253IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of I/O Lines:

11

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

XMS430AFE253IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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