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XMS430FR2311IPW20R

Texas Instruments

XMS430FR2311IPW20R by Texas Instruments

XMS430FR2311IPW20R by Texas Instruments is a 16-bit microcontroller with 3840 ROM words, 1024 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and features peripherals like PWM, RTC, and TIMER(2). Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,743 parts In-Stock

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8,743

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Digiode

USA . 3,564 parts In-Stock

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3,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,048 parts In-Stock

1+ parts

$13.000

100+ parts

-

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1,048

$13.000

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$13.523

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595

$13.523

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Parana Technologies

USA . 1,042 parts In-Stock

1+ parts

$69.096

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1,042

$69.096

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DigiPath Technology Company

USA . 189 parts In-Stock

1+ parts

$76.083

100+ parts

$69.997

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189

$76.083

$69.997

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ChromeModa Solutions

Germany . 3,950 parts In-Stock

1+ parts

$77.636

100+ parts

$63.662

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3,950

$77.636

$63.662

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IDEA Electronic Components Group

UK . 1,466 parts In-Stock

1+ parts

$77.636

100+ parts

$73.754

1k+ parts

$69.872

10k+ parts

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1,466

$77.636

$73.754

$69.872

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Corphita

USA . 3,137 parts In-Stock

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Overview

Experience seamless performance and reliability with the XMS430FR2311IPW20R by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. With advanced features such as PWM, RTC, and multiple connectivity options including I2C and UART, this microcontroller offers unparalleled value and benefits to customers. Trust Texas Instruments for cutting-edge technology and innovative solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for various applications.

Bit Size: 16

Offers a high number of bits for processing data, allowing for more complex operations and calculations.

ADC Channels: YES

Includes Analog to Digital Converter channels, enabling the microcontroller to interface with analog sensors and devices.

ROM Words: 3840

Offers a large amount of Read-Only Memory for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing architecture, which can result in efficient performance and lower power consumption.

Connectivity: I2C, IRDA, SPI, UART

Supports multiple communication protocols, allowing for easy integration with other devices and systems.

Technical Specifications

Microcontrollers XMS430FR2311IPW20R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Bytes:

1024

ROM Words:

3840

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

XMS430FR2311IPW20R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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