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XMS430F5172IRSBR

Texas Instruments

XMS430F5172IRSBR by Texas Instruments

Texas Instruments XMS430F5172IRSBR is a 16-bit microcontroller with 40 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a wide temperature range (-40 to 85°C) and low power consumption (2.4-3.6V).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,625 parts In-Stock

1+ parts

-

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7,625

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Digiode

USA . 2,416 parts In-Stock

1+ parts

-

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-

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2,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$8.017

100+ parts

-

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639

$8.017

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One Stop Electronics

USA . 1,526 parts In-Stock

1+ parts

$10.000

100+ parts

-

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1,526

$10.000

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Parana Technologies

USA . 929 parts In-Stock

1+ parts

$63.097

100+ parts

-

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929

$63.097

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ChromeModa Solutions

Germany . 3,291 parts In-Stock

1+ parts

$70.896

100+ parts

$58.135

1k+ parts

-

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3,291

$70.896

$58.135

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$70.896

100+ parts

$67.351

1k+ parts

$63.806

10k+ parts

-

1,139

$70.896

$67.351

$63.806

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Corphita

USA . 1,742 parts In-Stock

1+ parts

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1,742

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DigiPath Technology Company

USA . 1,643 parts In-Stock

1+ parts

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100+ parts

$63.920

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1,643

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$63.920

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Overview

Experience the cutting-edge technology of the XMS430F5172IRSBR microcontroller from Texas Instruments. Designed with precision and innovation, this versatile device offers a wide range of applications in various industries. With high-quality materials and advanced features such as ADC channels and DMA channels, this microcontroller provides superior performance and reliability. Trust in Texas Instruments to deliver top-notch products that exceed expectations and elevate your projects to new heights. Unlock endless possibilities with the XMS430F5172IRSBR and bring your ideas to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the microcontroller lightweight and durable, ideal for portable and long-lasting electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility for different applications.

Bit Size: 16

The 16-bit architecture of the microcontroller allows for faster and more efficient processing of data, making it suitable for high-performance tasks.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the microcontroller to function reliably in harsh environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based microcontroller architecture enables efficient and streamlined processing of instructions, leading to faster performance and lower power consumption.

Maximum Clock Frequency: 25 MHz

The high clock frequency allows the microcontroller to execute instructions quickly, making it suitable for applications that require fast data processing.

Technical Specifications

Microcontrollers XMS430F5172IRSBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

31

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

XMS430F5172IRSBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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