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XMS430F5510IRGCR

Texas Instruments

XMS430F5510IRGCR by Texas Instruments

XMS430F5510IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. Ideal for industrial applications, it features 4096 bytes of RAM, ADC and DMA channels, and flash ROM programmability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,306 parts In-Stock

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Vyrian

USA . 2,119 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 710 parts In-Stock

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$16.728

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710

$16.728

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One Stop Electronics

USA . 627 parts In-Stock

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$24.000

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627

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Parana Technologies

USA . 972 parts In-Stock

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$34.940

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DigiPath Technology Company

USA . 11 parts In-Stock

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$38.473

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11

$38.473

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ChromeModa Solutions

Germany . 6,961 parts In-Stock

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$39.258

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$32.192

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$39.258

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IDEA Electronic Components Group

UK . 1,845 parts In-Stock

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$39.258

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$37.295

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$35.332

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1,845

$39.258

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$35.332

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Corphita

USA . 1,547 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of innovation with the XMS430F5510IRGCR by Texas Instruments, a cutting-edge microcontroller that embodies excellence in quality and performance. Designed with precision and expertise, this product offers countless possibilities in various applications. From robotics to industrial automation, this microcontroller delivers unparalleled value, efficiency, and reliability. Experience seamless integration and unmatched versatility with Texas Instruments' superior technology. Elevate your projects and unleash your creativity with the XMS430F5510IRGCR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

Compact shape, efficient use of space on the circuit board.

Bit Size: 16

Provides sufficient processing power for a wide range of applications.

Power Supplies (V): 2/3.3

Compatible with common voltage levels, allowing for easy integration into existing systems.

No. of Terminals: 64

Sufficient number of terminals for connecting to other components or peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options, suitable for different mounting and cooling requirements.

Minimum Supply Voltage: 2.4 V

Can operate at relatively low voltage levels, ideal for energy-efficient designs.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

CPU Family: MSP430

Part of a well-known and reliable family of microcontrollers.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, suitable for harsh environments.

ADC Channels: YES

Integrated analog-to-digital converters for sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access for efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position for stable and secure connections.

ROM Words: 32768

Sufficient memory for program storage and data retention.

Maximum Seated Height: 1 mm

Low-profile design for space-constrained applications.

Width: 9 mm

Compact width for board space optimization.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing and response times.

Length: 9 mm

Compact length for board space optimization.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges and environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and high-performance computing.

RAM Bytes: 4096

Sufficient RAM for temporary data storage and program execution.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental and regulatory compliance.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM for reprogrammable memory storage.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board layout and efficient connections.

Speed: 25 rpm

High-speed performance for rapid data processing and system operation.

No. of I/O Lines: 47

Sufficient I/O lines for input/output interfacing and connectivity with external devices.

Technical Specifications

Microcontrollers XMS430F5510IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Trade Compliance

XMS430F5510IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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