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XMS430FR2311IPW16R

Texas Instruments

XMS430FR2311IPW16R by Texas Instruments

XMS430FR2311IPW16R by Texas Instruments is a 16-bit microcontroller with 3840 ROM words, 1024 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and features peripherals like PWM, RTC, and TIMER(2). Ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,236 parts In-Stock

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2,236

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Digiode

USA . 1,100 parts In-Stock

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1,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$11.580

100+ parts

-

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419

$11.580

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One Stop Electronics

USA . 294 parts In-Stock

1+ parts

$13.000

100+ parts

-

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294

$13.000

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Parana Technologies

USA . 10 parts In-Stock

1+ parts

$24.160

100+ parts

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$24.815

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10

$24.160

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$24.815

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DigiPath Technology Company

USA . 2,229 parts In-Stock

1+ parts

$26.603

100+ parts

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2,229

$26.603

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ChromeModa Solutions

Germany . 2,154 parts In-Stock

1+ parts

$27.146

100+ parts

$22.260

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2,154

$27.146

$22.260

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IDEA Electronic Components Group

UK . 985 parts In-Stock

1+ parts

$27.146

100+ parts

$25.789

1k+ parts

$24.431

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985

$27.146

$25.789

$24.431

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Corphita

USA . 2,777 parts In-Stock

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2,777

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Overview

Unlock the power of innovation with the XMS430FR2311IPW16R by Texas Instruments, a top-tier microcontroller designed to deliver unparalleled performance and reliability. Crafted with precision and expertise, this cutting-edge device offers a wide range of applications in various industries. From industrial automation to consumer electronics, this versatile microcontroller boasts advanced features like PWM, RTC, and multiple connectivity options. Experience seamless operation, high-speed processing, and efficient power management with this quality product. Elevate your projects to new heights with the XMS430FR2311IPW16R and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and resistance to external factors, making the microcontroller suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the microcontroller onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V enables flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular package shape offers easy handling and integration into standard PCB layouts for streamlined design and assembly processes.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and precision, making the microcontroller suitable for applications requiring higher computational performance.

No. of Terminals: 16

16 terminals offer sufficient connectivity options for interfacing with external components and peripherals, allowing for versatile application compatibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style enables compact and space-efficient PCB designs, ideal for size-constrained applications.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8 V allows for low power operation, making the microcontroller suitable for energy-efficient designs and battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures reliable performance in demanding environmental conditions without compromising functionality.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance of -40°C enables operation in cold environments, expanding the range of potential applications for the microcontroller.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections for consistent performance.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, facilitating sensor interfacing and data acquisition in a wide range of applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and component placement, allowing for optimized signal routing and efficient board design.

ROM Words: 3840

3840 ROM words offer ample memory capacity for program storage and data retention, supporting complex algorithms and application requirements.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2 mm enables slim and compact device designs, ideal for space-constrained applications with limited vertical clearance.

Width: 4.4 mm

Narrow width of 4.4 mm allows for efficient use of board space, facilitating compact and densely populated PCB layouts for miniaturized electronic devices.

Peripherals: PWM, RTC, TIMER(2)

Inclusion of peripherals such as PWM, RTC, and two timers enhances the microcontroller's functionality and versatility, enabling precise timing control and signal modulation capabilities.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz offers fast processing speeds, ensuring rapid execution of tasks and responsive system performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time allowance of 30 seconds at peak reflow temperature facilitates reliable soldering processes during assembly, ensuring proper connection and solder joint integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C supports lead-free soldering methods for environmentally friendly manufacturing practices.

Length: 5 mm

Compact length of 5 mm contributes to a small footprint and space-efficient PCB layout design, suitable for portable and handheld electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating ensures reliable operation in harsh industrial environments with wide temperature fluctuations, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient and optimized processing performance, ideal for embedded control applications requiring fast execution and low power consumption.

RAM Bytes: 1024

1024 bytes of RAM capacity support data storage and manipulation, enabling efficient multitasking and data processing capabilities for diverse application requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the microcontroller's energy efficiency and reliability in noise-sensitive environments.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and ease of soldering during assembly, ensuring robust electrical connections and reliable operation.

Analog To Digital Convertors: 8-Ch 10-Bit

8-channel 10-bit ADC converters enable multi-channel analog signal processing and conversion, supporting a variety of sensor interfaces and measurement applications.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage of 2.2 V ensures consistent and reliable operation, offering compatibility with standard power sources for seamless integration.

PWM Channels: YES

Availability of PWM channels allows for precise control of pulse-width modulation signals, enabling efficient motor control and power management in various applications.

Connectivity: I2C, IRDA, SPI, UART

Support for multiple connectivity options including I2C, IRDA, SPI, and UART facilitates seamless communication with external devices, peripherals, and networks for enhanced system integration.

ROM Programmability: FRAM

Programmability with FRAM technology offers fast and reliable non-volatile memory storage, ensuring secure program retention and data integrity for critical applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density mounting on PCBs, enabling compact designs and efficient use of board space for miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 2

MSL level 2 compliance indicates moderate sensitivity to moisture exposure, requiring standard handling precautions during storage and assembly processes to prevent performance degradation.

Speed: 16 rpm

Speed rating of 16 revolutions per minute indicates efficient processing capabilities and fast execution of tasks, ensuring responsive performance in time-critical applications.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width provides sufficient memory space for storing program instructions and data, supporting versatile application development and functionality.

No. of I/O Lines: 11

11 I/O lines offer versatile connectivity options for interfacing with external devices and components, allowing for flexible system configurations and expansion capabilities.

Technical Specifications

Microcontrollers XMS430FR2311IPW16R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

11

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

3840

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

XMS430FR2311IPW16R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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