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XMS430F5438AIPZ

Texas Instruments

XMS430F5438AIPZ by Texas Instruments

Texas Instruments XMS430F5438AIPZ is a 16-bit microcontroller with 262144 ROM words, 16384 RAM bytes, and 87 I/O lines. It operates at a max clock frequency of 18 MHz and has PWM channels for various applications in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,310 parts In-Stock

1+ parts

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4,310

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Digiode

USA . 1,292 parts In-Stock

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1,292

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Distributors (Availability)

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AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$7.610

100+ parts

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539

$7.610

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One Stop Electronics

USA . 1,632 parts In-Stock

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$16.000

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1,632

$16.000

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Parana Technologies

USA . 369 parts In-Stock

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$46.635

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369

$46.635

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IDEA Electronic Components Group

UK . 2,099 parts In-Stock

1+ parts

$52.399

100+ parts

$49.779

1k+ parts

$47.159

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-

2,099

$52.399

$49.779

$47.159

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ChromeModa Solutions

Germany . 1,720 parts In-Stock

1+ parts

$52.399

100+ parts

$42.967

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1,720

$52.399

$42.967

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Corphita

USA . 4,597 parts In-Stock

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4,597

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DigiPath Technology Company

USA . 1,102 parts In-Stock

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$47.243

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1,102

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$47.243

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Overview

Elevate your projects with the XMS430F5438AIPZ microcontroller from Texas Instruments, a top-tier manufacturer known for their commitment to quality and innovation. Ideal for a wide range of applications, this powerful 16-bit microcontroller offers customers unparalleled value and benefits. With features such as ADC and DMA channels, PWM capabilities, and a maximum clock frequency of 18 MHz, this versatile device provides seamless performance and reliability. Upgrade your designs with the XMS430F5438AIPZ and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability of the microcontroller.

Surface Mount: YES

Allows for easy integration onto PCBs.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and power efficiency.

Power Supplies (V): 2/3.3

Compatible with common power supply voltages in electronic devices.

No. of Terminals: 100

Provides ample connectivity options for external devices.

Maximum Clock Frequency: 18 MHz

Enables fast processing speed for applications.

RAM Bytes: 16384

Sufficient memory for storing variables and data during operation.

ROM Programmability: FLASH

Allows for easy reprogramming of the microcontroller.

Technical Specifications

Microcontrollers XMS430F5438AIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ITS ALSO OPERATES MINIMUM 1.8V AT 12MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

18 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

87

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XMS430F5438AIPZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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