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XMS430FR2476TRHAR

Texas Instruments

XMS430FR2476TRHAR by Texas Instruments

XMS430FR2476TRHAR by Texas Instruments is a 16-bit microcontroller with 66048 ROM words, 8192 RAM bytes, and 10-Ch 12-Bit ADC channels. Ideal for industrial applications, it features peripherals like BOR, POR, RTC, and UART connectivity. Operating temperature ranges from -40 to 105 °C with a supply voltage of 1.8-3.6 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,803 parts In-Stock

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3,803

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Digiode

USA . 3,532 parts In-Stock

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3,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 197 parts In-Stock

1+ parts

$6.000

100+ parts

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197

$6.000

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AZTECH Wire

Italy . 298 parts In-Stock

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$17.607

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298

$17.607

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Parana Technologies

USA . 1,477 parts In-Stock

1+ parts

$23.128

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$23.765

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1,477

$23.128

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$23.765

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DigiPath Technology Company

USA . 1,515 parts In-Stock

1+ parts

$25.467

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$23.430

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1,515

$25.467

$23.430

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ChromeModa Solutions

Germany . 5,536 parts In-Stock

1+ parts

$25.987

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$21.309

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5,536

$25.987

$21.309

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IDEA Electronic Components Group

UK . 1,535 parts In-Stock

1+ parts

$25.987

100+ parts

$24.688

1k+ parts

$23.388

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1,535

$25.987

$24.688

$23.388

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Corphita

USA . 2,171 parts In-Stock

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2,171

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Overview

Discover the power and reliability of the XMS430FR2476TRHAR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that provide endless possibilities for your projects. Whether you're working on IoT devices, consumer electronics, or industrial applications, this chip's advanced features and impressive performance will exceed your expectations. With its wide supply voltage range, high-speed operation, and versatile peripherals, the XMS430FR2476TRHAR offers unbeatable value and flexibility. Upgrade your designs with this innovative microcontroller and unlock a world of potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 16

Offers a good balance between processing power and efficiency for various applications.

ADC Channels: YES

Includes Analog to Digital Converters, allowing for precise measurements and sensor interfacing.

ROM Words: 66048

Provides ample storage capacity for program memory, allowing for complex algorithms and applications to be run.

RAM Bytes: 8192

Offers sufficient random access memory for data processing and storage.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computer architecture for efficient and streamlined operation.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and high reliability.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Supports multiple communication protocols, enabling seamless connectivity with other devices.

Technical Specifications

Microcontrollers XMS430FR2476TRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

35

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

66048

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

XMS430FR2476TRHAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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