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XIO2221ZAY

Texas Instruments

XIO2221ZAY by Texas Instruments

XIO2221ZAY by Texas Instruments is a bus controller with 167 terminals, operating at 0-70°C. It supports PCI, ISA, CardBus, and VGA buses with a supply voltage range of 1.35-3.3V. This low-profile IC in a square package is ideal for applications requiring IEEE 1394 drive interface standards.

Median Price

$11.512

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$9.210

1k+ parts

$8.240

10k+ parts

$7.750

160

-

$9.210

$8.240

$7.750

DigiKey

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$12.110

1k+ parts

-

10k+ parts

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160

-

$12.110

-

-

Verical

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$11.512

1k+ parts

$10.300

10k+ parts

$9.688

160

-

$11.512

$10.300

$9.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,268 parts In-Stock

1+ parts

$8.446

100+ parts

-

1k+ parts

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10k+ parts

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2,268

$8.446

-

-

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Vyrian

USA . 8,809 parts In-Stock

1+ parts

-

100+ parts

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8,809

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-

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DigiKey Marketplace

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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160

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 35 parts In-Stock

1+ parts

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100+ parts

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35

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Cyclops Electronics Ltd

UK . 25 parts In-Stock

1+ parts

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25

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Prism Electronics

USA . 20 parts In-Stock

1+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 382 parts In-Stock

1+ parts

$8.001

100+ parts

-

1k+ parts

-

10k+ parts

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382

$8.001

-

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Microchip USA

USA . 4,419 parts In-Stock

1+ parts

$13.780

100+ parts

-

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4,419

$13.780

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Corohmni

South Africa . 14 parts In-Stock

1+ parts

$68.424

100+ parts

-

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14

$68.424

-

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Parana Technologies

USA . 1,231 parts In-Stock

1+ parts

$76.865

100+ parts

-

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1,231

$76.865

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DigiPath Technology Company

USA . 249 parts In-Stock

1+ parts

$84.638

100+ parts

$77.867

1k+ parts

-

10k+ parts

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249

$84.638

$77.867

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ChromeModa Solutions

Germany . 6,651 parts In-Stock

1+ parts

$86.365

100+ parts

$70.819

1k+ parts

-

10k+ parts

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6,651

$86.365

$70.819

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$86.365

100+ parts

$82.047

1k+ parts

$77.728

10k+ parts

-

1,118

$86.365

$82.047

$77.728

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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A-Z Elektronik GmbH

Germany . 173 parts In-Stock

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173

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Overview

Experience seamless and efficient data transfer with the XIO2221ZAY bus controller by Texas Instruments. Crafted with precision and quality, this innovative product offers a wide range of applications in various industries. From PCI to ISA, CardBus to VGA, this versatile device is designed to meet all your connectivity needs. With a user-friendly design and reliable performance, the XIO2221ZAY ensures smooth operation and enhanced productivity. Trust Texas Instruments for cutting-edge technology and unparalleled value. Elevate your system with the XIO2221ZAY today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and heat resistance, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact and space-efficient design, making it easier to integrate into different systems.

Maximum Supply Voltage: 1.65 V

Low maximum supply voltage helps in reducing power consumption and heat generation, leading to improved energy efficiency.

Package Shape: SQUARE

Square shape package provides uniform and efficient distribution of components, enhancing reliability and performance.

Power Supplies (V): 1.5,1.95,3.3

Multiple power supply options allow for flexibility in voltage requirements, making it compatible with a wide range of systems.

No. of Terminals: 167

High number of terminals enable connectivity with a large number of devices, expanding the capabilities of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array and fine pitch design enhance the electrical performance and reliability of the product, ensuring efficient signal transmission.

Minimum Supply Voltage: 1.35 V

Low minimum supply voltage allows for operation in low power scenarios, contributing to overall energy efficiency.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance even in challenging thermal conditions.

Minimum Operating Temperature - 0 °C

Low minimum operating temperature capability enables usage in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides corrosion resistance and excellent conductivity for optimal signal transmission.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection with other components, improving overall system reliability.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for compact installation and reduces the overall profile of the product.

Width: 12 mm

Optimal width dimension enables efficient PCB layout and integration into different system designs.

External Data Bus Width: 8

8-bit external data bus width provides sufficient data handling capacity, supporting high-speed communication between devices.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for proper soldering and bonding, ensuring robust mechanical connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables reliable soldering without compromising the integrity of the components.

Length: 12 mm

Balanced length dimension offers a compact form factor for easy integration into various system configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance under normal operating conditions, making it suitable for standard applications.

Peripheral IC Type: BUS CONTROLLER, PCI

Peripheral IC type as a bus controller for PCI ensures efficient and accurate communication between different peripheral devices, enhancing system control.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, reducing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliability under varying load conditions.

Bus Compatibility: PCI; ISA; CARDBUS; VGA

Compatibility with multiple bus standards allows for versatile connectivity options, enabling integration into various systems and platforms.

Terminal Pitch: 0.8 mm

Fine terminal pitch enhances signal integrity and reduces crosstalk, ensuring high-speed and reliable data transmission.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture exposure, requiring standard handling and storage practices for optimal performance.

Drive Interface Standard: IEEE 1394; IEEE 1394A; IEEE 13

Support for multiple drive interface standards enables compatibility with a wide range of storage devices, enhancing system flexibility and data access.

Technical Specifications

Bus Controllers XIO2221ZAY attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

PCI; ISA; CARDBUS; VGA

Drive Interface Standard:

IEEE 1394; IEEE 1394A; IEEE 13

External Data Bus Width:

8

JESD-30 Code:

S-PBGA-B167

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

167

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA167,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.95,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2221ZAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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