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XIO2213BIZAY

Texas Instruments

XIO2213BIZAY by Texas Instruments

XIO2213BIZAY by Texas Instruments is a bus controller with 167 terminals, operating at -40 to 85°C. It supports PCI, ISA, CardBus, and VGA buses with an external data bus width of 8 bits. The package is a low-profile grid array measuring 12mm x 12mm and has a terminal pitch of 0.8mm for industrial applications.

Median Price

$11.702

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 185 parts In-Stock

1+ parts

$8.200

100+ parts

$8.040

1k+ parts

$7.870

10k+ parts

-

185

$8.200

$8.040

$7.870

-

Chip1Stop

Japan . 45 parts In-Stock

1+ parts

$11.525

100+ parts

$10.829

1k+ parts

-

10k+ parts

-

45

$11.525

$10.829

-

-

Arrow

USA . 45 parts In-Stock

1+ parts

$11.878

100+ parts

$10.509

1k+ parts

$9.948

10k+ parts

$9.650

45

$11.878

$10.509

$9.948

$9.650

Mouser Electronics

USA . 83 parts In-Stock

1+ parts

$14.960

100+ parts

$12.140

1k+ parts

$11.090

10k+ parts

$10.250

83

$14.960

$12.140

$11.090

$10.250

DigiKey

USA . 124 parts In-Stock

1+ parts

$15.610

100+ parts

$13.750

1k+ parts

-

10k+ parts

-

124

$15.610

$13.750

-

-

Avnet

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.219

10k+ parts

$8.964

230

-

-

$9.219

$8.964

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 836 parts In-Stock

1+ parts

$9.709

100+ parts

-

1k+ parts

-

10k+ parts

-

836

$9.709

-

-

-

Vyrian

USA . 6,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,080

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,881 parts In-Stock

1+ parts

$9.198

100+ parts

-

1k+ parts

-

10k+ parts

-

3,881

$9.198

-

-

-

Microchip USA

USA . 1,088 parts In-Stock

1+ parts

$11.180

100+ parts

$11.110

1k+ parts

$11.080

10k+ parts

$11.040

1,088

$11.180

$11.110

$11.080

$11.040

Parana Technologies

USA . 2,288 parts In-Stock

1+ parts

$26.664

100+ parts

-

1k+ parts

$27.220

10k+ parts

-

2,288

$26.664

-

$27.220

-

DigiPath Technology Company

USA . 1,261 parts In-Stock

1+ parts

$29.361

100+ parts

-

1k+ parts

-

10k+ parts

-

1,261

$29.361

-

-

-

ChromeModa Solutions

Germany . 2,059 parts In-Stock

1+ parts

$29.960

100+ parts

$24.567

1k+ parts

-

10k+ parts

-

2,059

$29.960

$24.567

-

-

IDEA Electronic Components Group

UK . 1,072 parts In-Stock

1+ parts

$29.960

100+ parts

$28.462

1k+ parts

$26.964

10k+ parts

-

1,072

$29.960

$28.462

$26.964

-

Corohmni

South Africa . 224 parts In-Stock

1+ parts

$77.577

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$77.577

-

-

-

Perfect Parts

USA . 538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

538

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock the power of seamless data transfer and connectivity with the XIO2213BIZAY by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that provide unparalleled performance and reliability. Perfect for a wide range of applications, this product offers customers the advantage of fast and efficient data processing, making it ideal for PCI, ISA, Cardbus, and VGA systems. Experience the value and benefits of smooth operation and enhanced connectivity with the XIO2213BIZAY, designed to meet your industrial needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and flexibility, making the product resistant to impact and environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the bus controller onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.65 V

The high maximum supply voltage ensures compatibility with a wide range of electronic devices and power sources.

Package Shape: SQUARE

The square package shape helps in efficient placement of the bus controller on the motherboard or circuit board, optimizing space utilization.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages allows the bus controller to be used in various electronic systems with different power requirements.

No. of Terminals: 167

Having a high number of terminals enables the bus controller to connect to a wide range of input and output devices, enhancing its functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high performance in terms of signal transmission, heat dissipation, and overall PCB layout efficiency.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage ensures efficient power consumption and operation, making the bus controller suitable for energy-efficient devices.

Terminal Finish: TIN SILVER COPPER

The tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure mounting of the bus controller onto the circuit board, improving stability and signal transmission.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact design of electronic devices, enhancing portability and aesthetics.

Width: 12 mm

The compact width of the bus controller facilitates easy integration into electronic systems with limited space, offering flexibility in design.

External Data Bus Width: 8

A wide external data bus width of 8 bits allows for faster data transmission between the bus controller and connected devices, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures that the bus controller can withstand high-temperature soldering processes without damage or degradation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the bus controller suitable for lead-free soldering processes, ensuring compliance with industry standards.

Length: 12 mm

The compact length of the bus controller allows for efficient placement on the circuit board, optimizing space utilization and enabling versatile design options.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making the bus controller suitable for industrial applications where temperature fluctuations are common.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a bus controller with PCI interface, the product facilitates efficient communication and data transfer between various peripheral devices and the system bus, enhancing system performance and compatibility.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the bus controller energy-efficient and reliable for use in a wide range of electronic systems.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections between the bus controller and the circuit board, ensuring stable operation and durability of the product.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage of 1.5V ensures consistent and reliable performance of the bus controller, making it suitable for a wide range of electronic applications.

Bus Compatibility: PCI; ISA; CARDBUS; VGA

Support for PCI, ISA, CardBus, and VGA bus compatibility enables the bus controller to be used in diverse electronic systems and interface with a variety of peripheral devices, enhancing system flexibility and versatility.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting of the bus controller on the circuit board, maximizing space utilization and improving signal integrity.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the bus controller is moderately sensitive to moisture, requiring careful handling during storage and assembly to prevent damage and ensure optimal performance.

Drive Interface Standard: IEEE 1394; IEEE 1394A; IEEE 13

Support for IEEE 1394, IEEE 1394A, and IEEE 13 drive interfaces ensures compatibility with a wide range of storage devices and peripherals, enhancing the connectivity options of the bus controller.

Technical Specifications

Bus Controllers XIO2213BIZAY attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

PCI; ISA; CARDBUS; VGA

Drive Interface Standard:

IEEE 1394; IEEE 1394A; IEEE 13

External Data Bus Width:

8

JESD-30 Code:

S-PBGA-B167

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

167

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA167,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2213BIZAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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