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XIO2200GGW

Texas Instruments

XIO2200GGW by Texas Instruments

XIO2200GGW by Texas Instruments is a bus controller with 176 terminals in a square package. It operates b/w 0-70°C, suitable for commercial applications. With power supplies of 1.5V and 3.3V, it is ideal for surface mount designs requiring fine pitch grid array packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,465 parts In-Stock

1+ parts

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3,465

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Vyrian

USA . 3,293 parts In-Stock

1+ parts

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3,293

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$18.855

100+ parts

-

1k+ parts

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564

$18.855

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One Stop Electronics

USA . 556 parts In-Stock

1+ parts

$27.000

100+ parts

-

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556

$27.000

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Parana Technologies

USA . 1,902 parts In-Stock

1+ parts

$33.428

100+ parts

-

1k+ parts

$125.412

10k+ parts

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1,902

$33.428

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$125.412

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ChromeModa Solutions

Germany . 3,811 parts In-Stock

1+ parts

$37.560

100+ parts

$30.799

1k+ parts

-

10k+ parts

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3,811

$37.560

$30.799

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IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$37.560

100+ parts

$35.682

1k+ parts

$33.804

10k+ parts

-

374

$37.560

$35.682

$33.804

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Corohmni

South Africa . 2,488 parts In-Stock

1+ parts

$56.579

100+ parts

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2,488

$56.579

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Corphita

USA . 1,871 parts In-Stock

1+ parts

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1,871

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DigiPath Technology Company

USA . 373 parts In-Stock

1+ parts

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100+ parts

$33.864

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373

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$33.864

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Microchip USA

USA . 300 parts In-Stock

1+ parts

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300

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Overview

Experience seamless and efficient data transfer with the XIO2200GGW by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers high-quality bus controllers that offer reliability and performance. Ideal for a variety of applications, this product provides value by optimizing connectivity and enhancing system functionality. Upgrade your technology with the XIO2200GGW and enjoy the benefits of superior design and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for use in various applications.

Surface Mount: YES

The surface-mount capability allows for easy installation and replacement of the bus controller, saving time and effort during assembly or repairs.

Power Supplies (V): 1.5,3.3

The bus controller can be powered using different voltage supplies, providing flexibility in design and compatibility with various power sources.

No. of Terminals: 176

With a large number of terminals, this bus controller can accommodate multiple connections, making it suitable for complex electronic systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding environments or applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the bus controller to function effectively in cold conditions without any performance issues.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection, reducing the risk of signal loss or interference in the system.

Terminal Pitch: 0.8 mm

The close terminal pitch of 0.8 mm allows for high-density mounting of components, making the bus controller suitable for compact electronic devices or systems.

Technical Specifications

Bus Controllers XIO2200GGW attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B176

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA176,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

XIO2200GGW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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