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VSP2560PT

Texas Instruments

VSP2560PT by Texas Instruments

VSP2560PT by Texas Instruments is a consumer circuit IC with 48 terminals in a square, flatpack package. It operates b/w -25°C to 85°C and has a supply voltage range of 2.7V to 3.6V. Ideal for applications requiring low profile, fine pitch components in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,788

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Vyrian

USA . 2,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,676

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,138 parts In-Stock

1+ parts

$1.263

100+ parts

-

1k+ parts

$2.029

10k+ parts

-

2,138

$1.263

-

$2.029

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DigiPath Technology Company

USA . 1,957 parts In-Stock

1+ parts

$1.391

100+ parts

-

1k+ parts

-

10k+ parts

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1,957

$1.391

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ChromeModa Solutions

Germany . 5,788 parts In-Stock

1+ parts

$1.419

100+ parts

$1.164

1k+ parts

-

10k+ parts

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5,788

$1.419

$1.164

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IDEA Electronic Components Group

UK . 6 parts In-Stock

1+ parts

$1.419

100+ parts

-

1k+ parts

$1.277

10k+ parts

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6

$1.419

-

$1.277

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AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$9.012

100+ parts

-

1k+ parts

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10k+ parts

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620

$9.012

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One Stop Electronics

USA . 953 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

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10k+ parts

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953

$13.800

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Corphita

USA . 1,728 parts In-Stock

1+ parts

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1k+ parts

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1,728

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Microchip USA

USA . 159 parts In-Stock

1+ parts

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159

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Overview

Unleash the power of innovation with the VSP2560PT by Texas Instruments. Designed with precision and expertise, this cutting-edge consumer IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional performance in a compact package. Experience the value and benefits of Texas Instruments technology with the VSP2560PT, providing customers with a competitive edge in the market. Elevate your projects to new heights with this state-of-the-art solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and can withstand various environmental factors, making the product long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a PCB, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB, especially when dealing with limited board space.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is suitable for a wide range of consumer electronics products, ensuring versatility and broad compatibility.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and functionalities, providing flexibility in circuit design and integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers compactness and space-saving benefits, ideal for small form factor devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can perform reliably even under moderate to high thermal conditions.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25°C makes this IC suitable for use in a variety of environments, including colder climates.

Terminal Position: QUAD

Quad terminal position simplifies the layout and routing of connections on the PCB, enhancing ease of installation and manufacturing.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm helps in reducing overall profile and form factor of the product, facilitating slim and sleek designs.

Width: 7 mm

The compact width of 7 mm contributes to the overall space-saving design of the IC, beneficial for applications with size constraints.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7 V allows for efficient power consumption and operation, leading to energy-efficient performance.

Length: 7 mm

The small length of 7 mm further adds to the compactness and space efficiency of the IC, making it suitable for compact electronic devices.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable solder connections, ensuring proper electrical contact and strong mechanical stability.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting, allowing for more connections in a limited space and enhancing circuit functionality.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides a suitable operating range for the IC, offering flexibility in power supply options.

Technical Specifications

Other Function Consumer ICs VSP2560PT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP2560PT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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