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VSP2265GSJ

Texas Instruments

VSP2265GSJ by Texas Instruments

VSP2265GSJ by Texas Instruments is a 96-terminal consumer IC with CMOS technology. It operates b/w -25°C to 85°C, with supply voltage range of 3V to 3.6V. This square-shaped IC in grid array package is ideal for various consumer circuit applications.

Median Price

$5.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$5.120

1k+ parts

$4.580

10k+ parts

$4.310

168

-

$5.120

$4.580

$4.310

DigiKey

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$5.920

1k+ parts

-

10k+ parts

-

168

-

$5.920

-

-

Verical

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$6.400

1k+ parts

$5.725

10k+ parts

$5.388

168

-

$6.400

$5.725

$5.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 92 parts In-Stock

1+ parts

$5.406

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$5.406

-

-

-

Vyrian

USA . 8,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,424

-

-

-

-

DigiKey Marketplace

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,734 parts In-Stock

1+ parts

$0.717

100+ parts

-

1k+ parts

$1.742

10k+ parts

-

1,734

$0.717

-

$1.742

-

ChromeModa Solutions

Germany . 3,387 parts In-Stock

1+ parts

$0.806

100+ parts

$0.661

1k+ parts

-

10k+ parts

-

3,387

$0.806

$0.661

-

-

IDEA Electronic Components Group

UK . 1,038 parts In-Stock

1+ parts

$0.806

100+ parts

-

1k+ parts

$0.725

10k+ parts

-

1,038

$0.806

-

$0.725

-

Corphita

USA . 1,586 parts In-Stock

1+ parts

$5.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

$5.121

-

-

-

DigiPath Technology Company

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

$0.727

1k+ parts

-

10k+ parts

-

2,282

-

$0.727

-

-

Microchip USA

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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400

-

-

-

-

Overview

Unlock the endless possibilities of technology with the VSP2265GSJ by Texas Instruments. Crafted with precision and expertise, this consumer circuit IC offers unparalleled quality and performance. From smart devices to automotive applications, this versatile component is designed to enhance functionality and efficiency. Embrace innovation and elevate your projects with the value and reliability that only Texas Instruments can deliver. Experience the difference with the VSP2265GSJ today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

The surface mount feature allows for easy and fast installation on PCBs, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape makes the product easy to handle and stack, optimizing space on the PCB.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, ensuring compatibility and performance in various devices.

No. of Terminals: 96

Having 96 terminals allows for multiple connection points, enabling complex circuit designs and functionalities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers high density integration, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the product to function effectively in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for long-term use.

Terminal Position: BOTTOM

With terminals positioned at the bottom, it simplifies the PCB layout and assembly process for enhanced efficiency.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes the overall profile of the product, ideal for slim and compact electronic devices.

Width: 9 mm

The 9mm width offers a balance between space-saving and ease of handling during installation and maintenance.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement allows for energy-efficient operation, suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the product can withstand standard reflow soldering processes without damage.

Length: 9 mm

The 9mm length offers a compact form factor, suitable for space-constrained electronic applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed performance, making it suitable for energy-efficient devices.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable performance, essential for stable operation in consumer electronics.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for fine-pitch connections, enabling high-density mounting and compact PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance of 3.6V offers flexibility in power supply options for different electronic devices.

Technical Specifications

Other Function Consumer ICs VSP2265GSJ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B96

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

VSP2265GSJ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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