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VSP2260Y

Texas Instruments

VSP2260Y by Texas Instruments

VSP2260Y by Texas Instruments is a consumer IC with 48 terminals in a square package. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.6V. This CMOS technology IC is suitable for various consumer circuit applications due to its low profile and fine pitch design.

Median Price

$9.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 810 parts In-Stock

1+ parts

-

100+ parts

$7.960

1k+ parts

$7.120

10k+ parts

$6.700

810

-

$7.960

$7.120

$6.700

DigiKey

USA . 810 parts In-Stock

1+ parts

-

100+ parts

$9.200

1k+ parts

-

10k+ parts

-

810

-

$9.200

-

-

Verical

USA . 224 parts In-Stock

1+ parts

-

100+ parts

$9.950

1k+ parts

$8.900

10k+ parts

$8.375

224

-

$9.950

$8.900

$8.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,977 parts In-Stock

1+ parts

$8.408

100+ parts

-

1k+ parts

-

10k+ parts

-

1,977

$8.408

-

-

-

Vyrian

USA . 4,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,647

-

-

-

-

DigiKey Marketplace

USA . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

810

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,202 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

$1.844

10k+ parts

-

2,202

$0.932

-

$1.844

-

DigiPath Technology Company

USA . 2,191 parts In-Stock

1+ parts

$1.026

100+ parts

$0.944

1k+ parts

-

10k+ parts

-

2,191

$1.026

$0.944

-

-

ChromeModa Solutions

Germany . 3,254 parts In-Stock

1+ parts

$1.047

100+ parts

$0.859

1k+ parts

-

10k+ parts

-

3,254

$1.047

$0.859

-

-

IDEA Electronic Components Group

UK . 202 parts In-Stock

1+ parts

$1.047

100+ parts

-

1k+ parts

$0.942

10k+ parts

-

202

$1.047

-

$0.942

-

Corphita

USA . 3,223 parts In-Stock

1+ parts

$7.965

100+ parts

-

1k+ parts

-

10k+ parts

-

3,223

$7.965

-

-

-

Kepictronics

USA . 9,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,920

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,928

-

-

-

-

Microchip USA

USA . 326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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326

-

-

-

-

A-Plus Industry Inc.

USA . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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76

-

-

-

-

Overview

Elevate your electronic projects with the VSP2260Y by Texas Instruments, a high-quality consumer circuit designed to deliver superior performance. With a sleek low-profile design and fine pitch package style, this IC offers exceptional reliability and precision in a compact form. Whether you're working on audio equipment, smart home devices, or automotive applications, the VSP2260Y provides the power and efficiency you need to bring your ideas to life. Trust in Texas Instruments' reputation for innovation and craftsmanship, and experience the value and benefits of the VSP2260Y in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and heat resistance, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Package Shape: SQUARE

The square shape helps in efficient space utilization on the circuit board, making it ideal for compact designs.

No. of Terminals: 48

The high number of terminals allows for connectivity with multiple external components, increasing the product's functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature guarantees proper functionality even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage allows for operation in power-constrained applications, maximizing flexibility.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage provides versatility in various power supply configurations, making the product adaptable to different systems.

Technical Specifications

Other Function Consumer ICs VSP2260Y attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP2260Y General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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