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V62/06669-01XE

Texas Instruments

V62/06669-01XE by Texas Instruments

V62/06669-01XE by Texas Instruments is a 13-bit ADC with 0.0391% EL, operating at 3.3V and 5V. Ideal for military applications, it offers a sample rate of 210MHz and features a BIPOLAR technology with GULL WING terminals in a SQUARE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,260 parts In-Stock

1+ parts

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3,260

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Vyrian

USA . 3,110 parts In-Stock

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3,110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 28 parts In-Stock

1+ parts

$13.791

100+ parts

-

1k+ parts

$14.278

10k+ parts

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28

$13.791

-

$14.278

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DigiPath Technology Company

USA . 1,935 parts In-Stock

1+ parts

$15.186

100+ parts

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1k+ parts

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1,935

$15.186

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ChromeModa Solutions

Germany . 4,244 parts In-Stock

1+ parts

$15.496

100+ parts

$12.707

1k+ parts

-

10k+ parts

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4,244

$15.496

$12.707

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IDEA Electronic Components Group

UK . 151 parts In-Stock

1+ parts

$15.496

100+ parts

$14.721

1k+ parts

$13.946

10k+ parts

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151

$15.496

$14.721

$13.946

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AZTECH Wire

Italy . 315 parts In-Stock

1+ parts

$18.515

100+ parts

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315

$18.515

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One Stop Electronics

USA . 186 parts In-Stock

1+ parts

$35.000

100+ parts

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186

$35.000

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Corphita

USA . 755 parts In-Stock

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755

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Overview

Elevate your analog-to-digital conversion experience with the V62/06669-01XE by Texas Instruments. As a leading manufacturer in innovative technology, Texas Instruments brings you a product that offers unparalleled quality and performance. Ideal for a wide range of applications, this converter boasts precision and reliability. The V62/06669-01XE provides customers with exceptional value, delivering precise data conversion with ease. Discover the benefits and advantages of this high-quality ADC, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

No. of Bits: 13

Higher number of bits allows for greater precision and accuracy in the conversion process, making this product suitable for applications requiring high resolution.

Maximum Linearity Error (EL): 0.0391%

Low linearity error ensures accurate conversion of analog signals to digital, making this product reliable for precise measurements and data acquisition.

Sample Rate: 210 MHz

High sample rate enables fast and efficient conversion of analog signals, making this product ideal for applications that require real-time data processing.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, making this product suitable for high-end applications where signal accuracy is critical.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliable performance in harsh environments, making this product suitable for rugged applications that require extended temperature operation.

Technical Specifications

Analog-to-Digital Converters V62/06669-01XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

13

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0391 %

Sample Rate:

210 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.2 V

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

410 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

80

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP80,.55SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G80

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/06669-01XE Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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