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V62/03608-02XE

Texas Instruments

V62/03608-02XE by Texas Instruments

V62/03608-02XE by Texas Instruments is a 14-bit ADC with 0.0183% EL, 3.3V supply, and 3MHz sample rate. Ideal for automotive applications, it features a compact square package with 48 terminals and operates b/w -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,944 parts In-Stock

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5,944

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Digiode

USA . 1,823 parts In-Stock

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1,823

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,636 parts In-Stock

1+ parts

$2.000

100+ parts

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1,636

$2.000

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Parana Technologies

USA . 2,081 parts In-Stock

1+ parts

$13.774

100+ parts

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$14.260

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2,081

$13.774

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$14.260

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DigiPath Technology Company

USA . 2,249 parts In-Stock

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$15.166

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2,249

$15.166

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ChromeModa Solutions

Germany . 6,774 parts In-Stock

1+ parts

$15.476

100+ parts

$12.690

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6,774

$15.476

$12.690

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IDEA Electronic Components Group

UK . 632 parts In-Stock

1+ parts

$15.476

100+ parts

$14.702

1k+ parts

$13.928

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632

$15.476

$14.702

$13.928

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AZTECH Wire

Italy . 536 parts In-Stock

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$17.246

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536

$17.246

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Corphita

USA . 3,777 parts In-Stock

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Overview

Experience precision and reliability with the V62/03608-02XE Analog-to-Digital Converter by Texas Instruments. As a leader in innovative technology, Texas Instruments delivers exceptional quality in every product. This ADC is perfect for automotive applications, offering a compact design with high performance. With a fast sample rate of 3 MHz and low linearity error of only 0.0183%, this converter ensures accurate data acquisition. Trust Texas Instruments to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the analog-to-digital converter.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 14

Offers high resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0183 %

Ensures precise and consistent conversion of input signals with minimal error.

Power Supplies (V): 3.3

Operates at a standard power supply voltage, suitable for many electronic applications.

No. of Terminals: 48

Provides multiple connection points for interfacing with external components and systems.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Offers various packaging options to suit different mounting and space requirements.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Maintains performance in cold conditions, ensuring reliability in diverse operating environments.

Terminal Position: QUAD

Facilitates easy connection and installation on circuit boards, enhancing ease of use.

Maximum Seated Height: 1.2 mm

Has a low profile design, allowing for compact placement within electronic devices.

Width: 7 mm

Compact size enables space-efficient integration in circuit designs.

Length: 7 mm

Compact size enables space-efficient integration in circuit designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for performance and durability.

Maximum Analog Input Voltage: 3.6 V

Supports a wide range of input voltages, making it versatile for different signal levels.

Sample Rate: 3 MHz

Delivers fast and accurate sampling of analog signals, suitable for high-speed applications.

Technology: CMOS

Utilizes CMOS technology for power efficiency and reliable signal conversion.

Terminal Form: GULL WING

Allows for easy soldering and connection to circuit boards, ensuring secure attachment.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes a proprietary method for analog-to-digital conversion, offering unique performance benefits.

Nominal Supply Voltage: 3.3 V

Operates at a stable supply voltage for consistent performance in various applications.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in output format for compatibility with different systems and signal processing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on circuit boards, saving space.

Minimum Analog Input Voltage: 0 V

Supports low input voltage levels, ensuring accurate conversion of small signals.

Output Format: PARALLEL, WORD

Offers multiple output formats for compatibility with diverse digital systems and processors.

Sample and Hold/Track and Hold: SAMPLE

Incorporates sample and hold functionality for accurate conversion of time-varying analog signals.

Technical Specifications

Analog-to-Digital Converters V62/03608-02XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Other Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0183 %

Sample Rate:

3 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

V62/03608-02XE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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