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V62/07607-01XE

Texas Instruments

V62/07607-01XE by Texas Instruments

V62/07607-01XE by Texas Instruments is a 12-bit ADC with 0.061% EL, operating at 3.3V and 5V. It features a sample rate of 500 MHz, MILITARY grade temp range, and GULL WING terminals. Ideal for applications requiring high-speed data conversion in harsh environments.

Median Price

$271.584

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 79 parts In-Stock

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Verical

USA . 78 parts In-Stock

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$271.584

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Digiode

USA . 4,715 parts In-Stock

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Vyrian

USA . 4,533 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 499 parts In-Stock

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$15.671

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$16.041

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499

$15.671

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$16.041

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IDEA Electronic Components Group

UK . 1,742 parts In-Stock

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$17.608

100+ parts

$16.728

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$15.847

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1,742

$17.608

$16.728

$15.847

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ChromeModa Solutions

Germany . 1,642 parts In-Stock

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$17.608

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$14.439

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1,642

$17.608

$14.439

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DigiPath Technology Company

USA . 617 parts In-Stock

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$15.875

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617

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$15.875

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Component Stockers USA

USA . 174 parts In-Stock

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Corphita

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Overview

Experience the unparalleled precision and reliability of the V62/07607-01XE Analog-to-Digital Converter by Texas Instruments. Crafted with high-quality materials and cutting-edge technology, this device offers exceptional performance in a wide range of applications. From industrial automation to medical imaging, this converter delivers accurate results with minimal linearity error and low power consumption. Trust Texas Instruments to provide you with top-of-the-line solutions for your analog-to-digital conversion needs. Choose excellence, choose the V62/07607-01XE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the internal components of the ADC, ensuring reliability and durability.

No. of Bits: 12

With a high number of bits, this ADC offers high resolution and accuracy in converting analog signals to digital data.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows for flexibility in different application scenarios, accommodating various power requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this ADC suitable for use in harsh environments or industrial settings where temperatures can rise significantly.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the ADC can operate effectively even in extremely cold conditions, making it versatile for different environments.

Technology: BIPOLAR

Bipolar technology offers accurate and precise analog-to-digital conversion, making this ADC ideal for applications that require high performance and reliability.

Sample Rate: 500 MHz

The high sample rate of 500 MHz enables fast and efficient conversion of analog signals, making this ADC suitable for high-speed applications that require real-time data processing.

Technical Specifications

Analog-to-Digital Converters V62/07607-01XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

500 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.2 V

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

365 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

80

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP80,.55SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G80

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/07607-01XE Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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