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V62/06648-01XE

Texas Instruments

V62/06648-01XE by Texas Instruments

V62/06648-01XE by Texas Instruments is a 14-bit ADC with 80 MHz sample rate, operating at -55 to 125°C. Suitable for military applications, it features 3.3/5V supplies, GULL WING terminals, and 2'S COMPLEMENT BINARY output code.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,031 parts In-Stock

1+ parts

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1,031

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Vyrian

USA . 649 parts In-Stock

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649

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 28 parts In-Stock

1+ parts

$9.850

100+ parts

-

1k+ parts

$10.416

10k+ parts

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28

$9.850

-

$10.416

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ChromeModa Solutions

Germany . 5,526 parts In-Stock

1+ parts

$11.067

100+ parts

$9.075

1k+ parts

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10k+ parts

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5,526

$11.067

$9.075

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IDEA Electronic Components Group

UK . 1,037 parts In-Stock

1+ parts

$11.067

100+ parts

$10.514

1k+ parts

$9.960

10k+ parts

-

1,037

$11.067

$10.514

$9.960

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AZTECH Wire

Italy . 200 parts In-Stock

1+ parts

$16.783

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200

$16.783

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One Stop Electronics

USA . 688 parts In-Stock

1+ parts

$26.000

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688

$26.000

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Corphita

USA . 2,465 parts In-Stock

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2,465

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DigiPath Technology Company

USA . 1,827 parts In-Stock

1+ parts

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100+ parts

$9.978

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1,827

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$9.978

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Overview

Experience unparalleled precision and reliability with the V62/06648-01XE Analog-to-Digital Converter by Texas Instruments. This cutting-edge product boasts a military-grade temperature grade, ensuring optimal performance in even the most demanding environments. With a fast sample rate of 80 MHz and a proprietary conversion method, this converter delivers accurate results every time. Whether you're in aerospace, defense, or industrial applications, the V62/06648-01XE offers unmatched quality and value that will exceed your expectations. Elevate your projects with Texas Instruments' superior technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product long-lasting and reliable.

No. of Bits: 14

The 14-bit resolution allows for high precision in converting analog signals to digital, making it suitable for applications requiring accurate measurements.

Sample Rate: 80 MHz

The high sample rate enables fast and efficient conversion of analog signals, making it suitable for applications with high-speed requirements.

Technology: BIPOLAR

Bipolar technology offers enhanced performance and accuracy in converting analog signals to digital, making it a reliable choice for various applications.

Maximum Analog Input Voltage: 2.2 V

The high maximum analog input voltage allows for flexibility in handling different signal levels, making it versatile for various applications.

Technical Specifications

Analog-to-Digital Converters V62/06648-01XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Sample Rate:

80 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

52

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Low Profile

Package Shape:

Package Equivalence Code:

HQFP52,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G52

Qualified:

No

Trade Compliance

V62/06648-01XE Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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