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V62/03609-01XE

Texas Instruments

V62/03609-01XE by Texas Instruments

V62/03609-01XE by Texas Instruments is a 12-bit ADC with 4 analog in channels, operating at a sample rate of 6 MHz. It features a max linearity error of 0.0439%, suitable for military-grade applications. With a compact package style and dual terminal position, it offers high performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,833 parts In-Stock

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Digiode

USA . 2,238 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 456 parts In-Stock

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$14.520

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$14.520

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Parana Technologies

USA . 1,894 parts In-Stock

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$19.935

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$19.882

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One Stop Electronics

USA . 909 parts In-Stock

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$21.000

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909

$21.000

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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$21.951

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$20.195

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ChromeModa Solutions

Germany . 4,259 parts In-Stock

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$22.399

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$18.367

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$22.399

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IDEA Electronic Components Group

UK . 201 parts In-Stock

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$22.399

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$21.279

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$20.159

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201

$22.399

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Corphita

USA . 4,244 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the V62/03609-01XE Analog-to-Digital Converter by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology in a compact package for applications requiring high-resolution conversion. This 12-bit converter offers exceptional linearity with minimal error, making it ideal for military-grade projects where accuracy is paramount. With a wide operating temperature range and low power consumption, this ADC provides unmatched value and performance to customers seeking superior quality and efficiency in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and less prone to damage during handling or transportation.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and throughput.

Surface Mount: YES

Surface mount technology makes it easy to integrate this ADC into compact designs, saving space on the PCB.

No. of Bits: 12

With 12-bit resolution, this ADC can provide high accuracy and precision in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0439%

The low linearity error ensures that the converted digital data closely represents the original analog signal, leading to accurate measurements.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows flexibility in system design and compatibility with various power sources.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options and allows for easy integration into existing circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space on the PCB and allows for dense circuit designs, ideal for applications with limited board space.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement makes this ADC suitable for low-power applications or battery-powered devices.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable performance in harsh environments or industrial applications.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the ADC to operate in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides good contact reliability and corrosion resistance, ensuring long-term performance and durability.

Maximum Analog Input Voltage: 4 V

Support for high analog input voltages allows the ADC to handle a wide range of input signals without saturation or distortion.

Sample Rate: 6 MHz

With a high sample rate of 6 MHz, this ADC can capture fast-changing signals accurately, making it suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the ADC reliable and energy efficient.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and ensures secure attachment to the PCB, enhancing reliability.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method used in this product may offer unique features or performance advantages compared to standard conversion techniques.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility with a wide range of applications.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Support for both binary and 2's complement binary output bit codes allows flexibility in interfacing with different digital systems or processors.

Minimum Analog Input Voltage: 1.4 V

The low minimum analog input voltage allows the ADC to capture small signals accurately, making it suitable for high-sensitivity applications.

Output Format: PARALLEL, WORD

The parallel output format allows for fast data transfer, while the word format simplifies interfacing with digital systems, enhancing versatility.

Sample and Hold/Track and Hold: SAMPLE

The sampling method used in this ADC ensures accurate conversion of analog signals at precise moments, minimizing signal distortion.

Moisture Sensitivity Level (MSL): 2

This MSL rating indicates that the ADC has a moderate level of moisture sensitivity, making it suitable for a variety of environmental conditions.

Technical Specifications

Analog-to-Digital Converters V62/03609-01XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0439 %

Sample Rate:

6 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1.4 V

Maximum Analog Input Voltage:

4 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

40 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.433 in (11 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/03609-01XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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