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ADS7841EB/2K5G4

Texas Instruments

ADS7841EB/2K5G4 by Texas Instruments

Texas Instruments ADS7841EB/2K5G4 is a 12-bit ADC with 4 analog channels, 0.0244% linearity error, and 3.75us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,308 parts In-Stock

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7,308

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Digiode

USA . 4,343 parts In-Stock

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4,343

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VNN

France . 3,704 parts In-Stock

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3,704

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 379 parts In-Stock

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$8.150

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379

$8.150

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Parana Technologies

USA . 909 parts In-Stock

1+ parts

$18.315

100+ parts

$1,700.854

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$16.484

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909

$18.315

$1,700.854

$16.484

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DigiPath Technology Company

USA . 669 parts In-Stock

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$20.167

100+ parts

$18.554

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669

$20.167

$18.554

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ChromeModa Solutions

Germany . 5,376 parts In-Stock

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$20.579

100+ parts

$16.875

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$20.579

$16.875

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IDEA Electronic Components Group

UK . 1,626 parts In-Stock

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$20.579

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$19.550

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$18.521

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1,626

$20.579

$19.550

$18.521

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Corohmni

South Africa . 110 parts In-Stock

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$27.003

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$27.003

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Semicontronic

India . 1,020 parts In-Stock

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$28.000

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$27.300

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$27.160

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$28.000

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$27.160

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Ampacity Inc.

Singapore . 353 parts In-Stock

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$34.000

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353

$34.000

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One Stop Electronics

USA . 1,540 parts In-Stock

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$38.000

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$38.000

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Continental Prestige Electronics

USA . 6,382 parts In-Stock

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Argo Parts USA

USA . 3,649 parts In-Stock

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Corphita

USA . 3,638 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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700

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Modulus Dynamics

Lithuania . 72 parts In-Stock

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72

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the superior quality and precision of the Texas Instruments ADS7841EB/2K5G4 Analog-to-Digital Converter. With a reputation for excellence in the industry, Texas Instruments delivers a cutting-edge product that offers unparalleled performance and reliability. Ideal for various applications, this converter provides customers with high value and benefits, ensuring accurate and efficient conversion of analog signals to digital data. Upgrade your system with this top-of-the-line converter and experience the advantages of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, making the product reliable for long-term use.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile input options and increased flexibility in capturing and converting analog signals.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, saving time and effort during production.

No. of Bits: 12

The 12-bit resolution ensures high accuracy in converting analog signals to digital data, making it suitable for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error percentage indicates high precision and accuracy in the conversion process, making it reliable for sensitive applications.

Power Supplies (V): 2.7/5

Supporting multiple power supply voltages allows for compatibility with different systems and power sources, enhancing the product's versatility.

No. of Terminals: 16

Having 16 terminals provides ample connections for external components and interfaces, enabling seamless integration with other parts of the system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the circuit board, making it suitable for compact designs and applications with limited space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to function effectively in cold environments, making it suitable for a wide range of applications.

Technical Specifications

Analog-to-Digital Converters ADS7841EB/2K5G4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.75 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7841EB/2K5G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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