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V62/03608-03XE

Texas Instruments

V62/03608-03XE by Texas Instruments

V62/03608-03XE by Texas Instruments is a 14-bit ADC with 0.0641% EL, 3.3V supplies, and 8MHz sample rate. Ideal for military applications, it features a MIL grade temp range of -55 to 125°C and operates in a compact 7x7mm flatpack package with quad terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,634 parts In-Stock

1+ parts

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8,634

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Digiode

USA . 1,113 parts In-Stock

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1,113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 13 parts In-Stock

1+ parts

$5.667

100+ parts

-

1k+ parts

$6.462

10k+ parts

-

13

$5.667

-

$6.462

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DigiPath Technology Company

USA . 1,896 parts In-Stock

1+ parts

$6.240

100+ parts

-

1k+ parts

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10k+ parts

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1,896

$6.240

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ChromeModa Solutions

Germany . 2,150 parts In-Stock

1+ parts

$6.367

100+ parts

$5.221

1k+ parts

-

10k+ parts

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2,150

$6.367

$5.221

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IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$6.367

100+ parts

-

1k+ parts

$5.730

10k+ parts

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68

$6.367

-

$5.730

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$15.256

100+ parts

-

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306

$15.256

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One Stop Electronics

USA . 912 parts In-Stock

1+ parts

$34.000

100+ parts

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912

$34.000

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Corphita

USA . 3,746 parts In-Stock

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3,746

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Overview

Experience the unparalleled quality of Texas Instruments with the V62/03608-03XE Analog-to-Digital Converter. Designed with precision and reliability in mind, this innovative product offers a wide range of applications in various industries. From its military-grade temperature grade to its advanced technology, the V62/03608-03XE guarantees top-notch performance and accuracy. Trust in Texas Instruments to deliver cutting-edge solutions that exceed your expectations and elevate your projects to new heights. Unlock the potential of your designs with the V62/03608-03XE today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the Analog-to-Digital Converter, making it durable and reliable for long-term use.

No. of Bits: 14

With 14 bits of resolution, this ADC can provide high accuracy in converting analog signals to digital, making it suitable for applications requiring precise measurements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this ADC to function in harsh environments without overheating or malfunctioning.

Sample Rate: 8 MHz

The high sample rate of 8 MHz enables this ADC to capture fast-changing analog signals accurately, making it ideal for applications with high-speed data acquisition requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance of the Analog-to-Digital Converter.

Technical Specifications

Analog-to-Digital Converters V62/03608-03XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Other Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0641 %

Sample Rate:

8 MHz

Hold Mode:

Sample

Maximum Conversion Time:

125 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-3.3 V

Maximum Analog Input Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

90 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/03608-03XE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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