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V62/03614-01XE

Texas Instruments

V62/03614-01XE by Texas Instruments

Texas Instruments V62/03614-01XE is a 12-bit ADC with 11 analog in channels, 0.0244% linearity error, and 5V power supply. Ideal for automotive applications, it offers a sample rate of 0.066 MHz and operates b/w -40 to 125°C. With a compact design and serial output format, it suits space-constrained environments requiring precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,135 parts In-Stock

1+ parts

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4,135

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Vyrian

USA . 2,434 parts In-Stock

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2,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,640 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,640

$4.000

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$11.995

100+ parts

-

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305

$11.995

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Parana Technologies

USA . 440 parts In-Stock

1+ parts

$18.703

100+ parts

-

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$18.796

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440

$18.703

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$18.796

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DigiPath Technology Company

USA . 77 parts In-Stock

1+ parts

$20.595

100+ parts

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77

$20.595

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ChromeModa Solutions

Germany . 1,962 parts In-Stock

1+ parts

$21.015

100+ parts

$17.232

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1,962

$21.015

$17.232

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IDEA Electronic Components Group

UK . 409 parts In-Stock

1+ parts

$21.015

100+ parts

$19.964

1k+ parts

$18.914

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409

$21.015

$19.964

$18.914

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Corphita

USA . 3,309 parts In-Stock

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3,309

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Overview

Discover the ultimate Analog-to-Digital Converter, the V62/03614-01XE by Texas Instruments! Designed with precision and reliability in mind, this small outline converter offers 12 bits of accuracy with a maximum linearity error of just 0.0244%. Ideal for automotive applications, this converter features a fast conversion time of 10 us and can handle analog input voltages up to 5.5V. With a low supply current of 2.5 mA and a sample rate of 0.066 MHz, the V62/03614-01XE provides high performance in a compact package. Trust Texas Instruments for quality and innovation in ADC technology.

Feature Benefit Bullets

No. of Analog In Channels: 11

Having 11 analog input channels allows for a wide range of input signals to be converted, making this ADC suitable for applications requiring multiple inputs.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide high accuracy in digitizing analog signals, making it suitable for precise measurements and applications requiring high resolution.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this ADC compact and suitable for space-constrained applications where size is a concern.

Temperature Grade: AUTOMOTIVE

Being automotive grade ensures that this ADC can withstand the harsh temperature conditions often found in automotive applications, providing reliability and durability.

Technology: CMOS

Using CMOS technology allows for low power consumption and high noise immunity, making this ADC efficient and reliable in various applications.

Technical Specifications

Analog-to-Digital Converters V62/03614-01XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/03614-01XE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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