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V62/04647-01XE

Texas Instruments

V62/04647-01XE by Texas Instruments

V62/04647-01XE by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0977% max linearity error, and 3.3V power supply. Ideal for automotive applications, it features a small outline package, operates b/w -40 to 125°C, and has a sample rate of 0.038 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,893 parts In-Stock

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4,893

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Digiode

USA . 1,204 parts In-Stock

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1,204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 796 parts In-Stock

1+ parts

$7.000

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-

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796

$7.000

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Parana Technologies

USA . 167 parts In-Stock

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$12.907

100+ parts

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$13.392

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167

$12.907

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$13.392

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AZTECH Wire

Italy . 762 parts In-Stock

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$13.032

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762

$13.032

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DigiPath Technology Company

USA . 541 parts In-Stock

1+ parts

$14.212

100+ parts

$13.075

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541

$14.212

$13.075

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ChromeModa Solutions

Germany . 6,727 parts In-Stock

1+ parts

$14.502

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$11.892

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6,727

$14.502

$11.892

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

1+ parts

$14.502

100+ parts

$13.777

1k+ parts

$13.052

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1,059

$14.502

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$13.052

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Corphita

USA . 624 parts In-Stock

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624

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Overview

Experience precision and reliability with the V62/04647-01XE Analog-to-Digital Converter by Texas Instruments. Crafted with high-quality materials and cutting-edge technology, this converter offers 10 bits of accuracy across 11 analog input channels. Ideal for automotive applications, this device brings unmatched value with a fast conversion time of 21 microseconds and low power consumption of just 2.5mA. Trust in Texas Instruments to deliver superior performance in a compact, easy-to-install package. Elevate your projects with the V62/04647-01XE today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the components inside and ensures durability, making the product reliable for long-term use.

No. of Analog In Channels: 11

Having 11 analog input channels allows for versatile and complex signal processing, making this product suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature makes installation and assembly easier, saving time and effort during production.

No. of Bits: 10

A higher number of bits results in a more accurate conversion of analog signals to digital, providing precise measurements and data.

Power Supplies (V): 3.3

The low power supply of 3.3V helps in reducing power consumption and making the product energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environments and operate reliably in various conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing the overall performance of the product.

Output Format: SERIAL

The serial output format allows for easier data transmission and integration with other digital systems, making the product more versatile in connectivity options.

Technical Specifications

Analog-to-Digital Converters V62/04647-01XE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

38 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/04647-01XE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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