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V62/03614-02YE

Texas Instruments

V62/03614-02YE by Texas Instruments

V62/03614-02YE by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 5V power supply. Ideal for military applications, it features a CMOS technology, 0.066 MHz sample rate, and operates b/w -55 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,799 parts In-Stock

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3,799

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Digiode

USA . 3,081 parts In-Stock

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3,081

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Distributors (Availability)

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One Stop Electronics

USA . 1,186 parts In-Stock

1+ parts

$3.000

100+ parts

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1,186

$3.000

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AZTECH Wire

Italy . 704 parts In-Stock

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$5.183

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704

$5.183

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Parana Technologies

USA . 2,214 parts In-Stock

1+ parts

$9.999

100+ parts

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$10.561

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2,214

$9.999

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$10.561

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ChromeModa Solutions

Germany . 5,649 parts In-Stock

1+ parts

$11.235

100+ parts

$9.213

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5,649

$11.235

$9.213

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IDEA Electronic Components Group

UK . 628 parts In-Stock

1+ parts

$11.235

100+ parts

$10.673

1k+ parts

$10.112

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628

$11.235

$10.673

$10.112

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Corphita

USA . 2,816 parts In-Stock

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2,816

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DigiPath Technology Company

USA . 1,633 parts In-Stock

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$10.129

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1,633

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$10.129

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Overview

Experience unmatched precision and reliability with the V62/03614-02YE by Texas Instruments, a cutting-edge Analog-to-Digital Converter designed to meet the highest industry standards. Elevate your projects with this versatile device that offers 11 analog input channels and a fast 10us conversion time. With a compact small outline package style and military-grade temperature grade, this ADC is ideal for a wide range of applications in demanding environments. Trust Texas Instruments for top-quality components that deliver exceptional performance every time. Unlock new possibilities and maximize efficiency with the V62/03614-02YE - your solution for superior analog-to-digital conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the analog-to-digital converter.

No. of Analog In Channels: 11

Having 11 analog input channels allows for versatility in measuring multiple signals simultaneously.

Surface Mount: YES

Being surface mountable makes installation and integration easier and more efficient.

No. of Bits: 12

With 12 bits, this ADC provides high resolution and accuracy in converting analog signals to digital values.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures precise and reliable conversion of analog data.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this ADC can withstand extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Output Format: SERIAL

Having a serial output format facilitates communication with other digital systems and devices.

Technical Specifications

Analog-to-Digital Converters V62/03614-02YE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

V62/03614-02YE Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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