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ADS1115QDGSRQ1

Texas Instruments

ADS1115QDGSRQ1 by Texas Instruments

Texas Instruments' ADS1115QDGSRQ1 is a 16-bit ADC with 4 analog in channels, operating at -40 to 125°C. Ideal for automotive applications, it offers a max linearity error of 0.0015%, accepts input voltages from -4.096V to 4.096V, and outputs data in serial format.

Median Price

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6

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1k+

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Chip Stock

USA . 39,766 parts In-Stock

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Digiode

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Nova Conductors

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NexGen Digital

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Vigor

Singapore . 2,500 parts In-Stock

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$3.050

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$3.050

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AZTECH Wire

Italy . 755 parts In-Stock

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$5.551

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Parana Technologies

USA . 758 parts In-Stock

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$17.855

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$18.033

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Corohmni

South Africa . 27 parts In-Stock

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$19.445

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DigiPath Technology Company

USA . 1,371 parts In-Stock

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$19.661

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$18.088

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ChromeModa Solutions

Germany . 2,451 parts In-Stock

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IDEA Electronic Components Group

UK . 2,108 parts In-Stock

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Ampacity Inc.

Singapore . 443 parts In-Stock

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One Stop Electronics

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Semicontronic

India . 701 parts In-Stock

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Argo Parts USA

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Alle Elektronik GmbH

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Microchip USA

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Overview

Unlock accurate and reliable measurements with the ADS1115QDGSRQ1 by Texas Instruments. As a leader in Analog-to-Digital Converters, Texas Instruments delivers a top-quality product perfect for automotive applications. With 4 analog input channels and impressive 16-bit resolution, this ADC offers unparalleled precision and performance. Whether you need to monitor temperature, pressure, or voltage, the ADS1115QDGSRQ1 provides the accuracy and reliability you can trust. Experience the value and benefits of Texas Instruments' cutting-edge technology in one compact and efficient package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the ADC, ensuring long-term reliability.

No. of Analog In Channels: 4

Allows for multiple input signals to be converted simultaneously, increasing efficiency and versatility.

Surface Mount: YES

SMT package enables easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

No. of Bits: 16

Provides high resolution and accuracy in digital conversion, making it ideal for applications requiring precise measurements.

Power Supplies (V): 3.3

Operates at a common and stable voltage, ensuring compatibility with standard power sources.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperatures, suitable for a wide range of operating conditions.

Maximum Analog Input Voltage: 4.096 V

Accommodates a wide range of input voltages, allowing for versatile input signal options.

Output Format: SERIAL

Produces data in a serial format, enabling easy integration with microcontrollers and digital systems.

Technical Specifications

Analog-to-Digital Converters ADS1115QDGSRQ1 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Other Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0015 %

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-4.096 V

Maximum Analog Input Voltage:

4.096 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e4

Screening Level:

AEC-Q100

Trade Compliance

ADS1115QDGSRQ1 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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