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ADS8860IDGSR

Texas Instruments

ADS8860IDGSR by Texas Instruments

ADS8860IDGSR by Texas Instruments is a 16-bit analog-to-digital converter (ADC) with a sample rate of 1 MHz. It operates at a supply voltage of 3V and has a max linearity error of 0.0031%. This ADC is commonly used in industrial applications requiring high precision and fast conversion times.

Median Price

$12.782

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,893 parts In-Stock

1+ parts

$12.782

100+ parts

$11.165

1k+ parts

$7.700

10k+ parts

-

33,893

$12.782

$11.165

$7.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$11.200

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-

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23

$11.200

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Digiode

USA . 3,359 parts In-Stock

1+ parts

$12.143

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3,359

$12.143

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Vyrian

USA . 4,364 parts In-Stock

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4,364

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Chip Stock

USA . 3,400 parts In-Stock

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3,400

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VNN

France . 602 parts In-Stock

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602

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Distributors (Availability)

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Parana Technologies

USA . 606 parts In-Stock

1+ parts

$9.091

100+ parts

-

1k+ parts

$9.747

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606

$9.091

-

$9.747

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DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$10.011

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2,223

$10.011

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ChromeModa Solutions

Germany . 965 parts In-Stock

1+ parts

$10.215

100+ parts

$8.376

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965

$10.215

$8.376

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IDEA Electronic Components Group

UK . 826 parts In-Stock

1+ parts

$10.215

100+ parts

$9.704

1k+ parts

$9.194

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826

$10.215

$9.704

$9.194

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Vigor

Singapore . 4,877 parts In-Stock

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$10.370

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4,877

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Semicontronic

India . 17,343 parts In-Stock

1+ parts

$10.860

100+ parts

$10.588

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$10.534

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17,343

$10.860

$10.588

$10.534

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Ampacity Inc.

Singapore . 17,174 parts In-Stock

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$10.860

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17,174

$10.860

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Continental Prestige Electronics

USA . 1,034 parts In-Stock

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$11.200

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$10.976

1,034

$11.200

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$10.976

Netroflash

USA . 100 parts In-Stock

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$11.200

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$10.640

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$10.416

100

$11.200

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$10.640

$10.416

Corohmni

South Africa . 255 parts In-Stock

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$11.200

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255

$11.200

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Corphita

USA . 321 parts In-Stock

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$11.504

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321

$11.504

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$11.536

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$10.959

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$10.959

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20

$11.536

$10.959

$10.959

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A-Z Elektronik GmbH

Germany . 6,135 parts In-Stock

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6,135

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Perfect Parts

USA . 5,600 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,090 parts In-Stock

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Argo Parts USA

USA . 3,665 parts In-Stock

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Kepictronics

USA . 95 parts In-Stock

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95

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Overview

Discover the ADS8860IDGSR by Texas Instruments, a high-quality Analog-to-Digital Converter that offers unmatched precision and reliability. With its advanced design and state-of-the-art technology, this converter delivers exceptional performance in a wide range of applications. Whether you're working on industrial automation, medical devices, or consumer electronics, the ADS8860IDGSR is your go-to solution. Experience the value and benefits it brings, from its compact size to its low power consumption. Trust Texas Instruments for superior products that exceed expectations. Upgrade your projects with the ADS8860IDGSR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Surface mounting allows for easy and efficient integration onto printed circuit boards, saving space and reducing assembly time.

No. of Bits: 16

With 16 bits resolution, this ADC provides high precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0031 %

The low linearity error ensures accurate conversion and reliable performance in measuring analog signals.

Power Supplies (V): 3

Operating at a power supply of 3V makes this ADC suitable for low power applications, reducing energy consumption.

No. of Terminals: 10

The 10 terminals provide versatile connectivity options and allow for easy integration into different circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, making it suitable for compact design requirements.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage requirement allows for operation in low voltage systems, expanding the ADC's applicability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions, ensuring reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The wide temperature range enables the ADC to function in extreme cold environments, making it suitable for industrial or outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Technical Specifications

Analog-to-Digital Converters ADS8860IDGSR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

710 ns

Electrical Specifications

Power Supplies:

3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

3 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

2.4 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8860IDGSR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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