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UCC38531N

Texas Instruments

UCC38531N by Texas Instruments

UCC38531N by Texas Instruments is a Power Management IC with 20 terminals in an IN-LINE package. It operates b/w 0-70°C, supporting supply voltages from 4.5V to 9V. Ideal for power supply support circuits in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,840 parts In-Stock

1+ parts

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7,840

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Digiode

USA . 258 parts In-Stock

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258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,216 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,216

$3.500

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Ampacity Inc.

Singapore . 1,412 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,412

$4.500

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AZTECH Wire

Italy . 618 parts In-Stock

1+ parts

$5.352

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618

$5.352

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Semicontronic

India . 863 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

863

$6.500

$6.338

$6.305

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Parana Technologies

USA . 100 parts In-Stock

1+ parts

$9.391

100+ parts

-

1k+ parts

$10.008

10k+ parts

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100

$9.391

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$10.008

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DigiPath Technology Company

USA . 1,003 parts In-Stock

1+ parts

$10.341

100+ parts

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1,003

$10.341

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ChromeModa Solutions

Germany . 5,471 parts In-Stock

1+ parts

$10.552

100+ parts

$8.653

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5,471

$10.552

$8.653

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IDEA Electronic Components Group

UK . 281 parts In-Stock

1+ parts

$10.552

100+ parts

$10.024

1k+ parts

$9.497

10k+ parts

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281

$10.552

$10.024

$9.497

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Corphita

USA . 1,891 parts In-Stock

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1,891

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Corohmni

South Africa . 331 parts In-Stock

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331

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Overview

Unlock the power of reliable and efficient energy management with the UCC38531N by Texas Instruments. Designed with top-quality materials and advanced technology, this Power Management IC offers exceptional performance in various applications. From maximizing energy efficiency to ensuring stable power supplies, this product delivers unmatched value and benefits to customers. Trust Texas Instruments for superior quality and innovation in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliable performance, making the product suitable for long-term use.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in challenging environmental conditions.

Width (mm): 7.62 mm

The compact width of 7.62mm makes the product suitable for space-constrained applications.

Technical Specifications

Power Management ICs UCC38531N attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T20

Length:

25.905 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/8.0

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UCC38531N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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