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UCC3911-2DP

Texas Instruments

UCC3911-2DP by Texas Instruments

UCC3911-2DP by Texas Instruments is a Power Management IC with 16 terminals in a small outline package. It operates b/w -20°C to 70°C, making it suitable for commercial applications. With gull wing terminals and a rectangular shape, it supports power supply circuits efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,667 parts In-Stock

1+ parts

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4,667

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Digiode

USA . 533 parts In-Stock

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533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 760 parts In-Stock

1+ parts

$0.500

100+ parts

-

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760

$0.500

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Semicontronic

India . 1,362 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

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1,362

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 723 parts In-Stock

1+ parts

$3.500

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723

$3.500

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Parana Technologies

USA . 1,177 parts In-Stock

1+ parts

$8.661

100+ parts

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$9.337

10k+ parts

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1,177

$8.661

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$9.337

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DigiPath Technology Company

USA . 1,707 parts In-Stock

1+ parts

$9.537

100+ parts

$8.774

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10k+ parts

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1,707

$9.537

$8.774

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ChromeModa Solutions

Germany . 6,995 parts In-Stock

1+ parts

$9.732

100+ parts

$7.980

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6,995

$9.732

$7.980

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IDEA Electronic Components Group

UK . 1,641 parts In-Stock

1+ parts

$9.732

100+ parts

$9.245

1k+ parts

$8.759

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1,641

$9.732

$9.245

$8.759

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AZTECH Wire

Italy . 347 parts In-Stock

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$16.847

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347

$16.847

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Corphita

USA . 2,482 parts In-Stock

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2,482

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Corohmni

South Africa . 303 parts In-Stock

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303

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Overview

Enhance your power management solutions with the UCC3911-2DP from Texas Instruments. Known for their high-quality products, TI delivers reliable and efficient Power Management ICs that cater to a wide range of applications. The UCC3911-2DP, with its small outline package and dual terminal position, offers customers the value of optimal performance in a compact design. Experience the benefits of seamless power supply support circuitry with this innovative product, designed to elevate your electronic devices to new heights. Choose Texas Instruments for superior quality and performance in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the Power Management IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, making integration into electronic devices straightforward.

No. of Terminals: 16

The high number of terminals allows for multiple connections and functions within the Power Management IC, increasing its versatility and capability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, making it suitable for a wide range of applications.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in circuit design and layout, enabling customization and optimization based on specific requirements.

Technical Specifications

Power Management ICs UCC3911-2DP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

LOW INTERNAL FET SWITCH VOLTAGE DROP

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

Length:

9.89 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

UCC3911-2DP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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