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UCC3911-3DP

Texas Instruments

UCC3911-3DP by Texas Instruments

UCC3911-3DP by Texas Instruments is a Power Management IC with 16 terminals, suitable for power supply support circuits. It operates b/w -20°C to 70°C, in a small outline package measuring 9.89mm x 3.9mm x 1.75mm. Ideal for surface mount applications requiring commercial temperature grade components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,344 parts In-Stock

1+ parts

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8,344

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Digiode

USA . 2,008 parts In-Stock

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2,008

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,516 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,516

$0.500

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Semicontronic

India . 299 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

299

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,383 parts In-Stock

1+ parts

$2.500

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-

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1,383

$2.500

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$10.071

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613

$10.071

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Parana Technologies

USA . 473 parts In-Stock

1+ parts

$18.876

100+ parts

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$18.952

10k+ parts

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473

$18.876

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$18.952

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DigiPath Technology Company

USA . 378 parts In-Stock

1+ parts

$20.785

100+ parts

$19.122

1k+ parts

-

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378

$20.785

$19.122

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ChromeModa Solutions

Germany . 5,605 parts In-Stock

1+ parts

$21.209

100+ parts

$17.391

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5,605

$21.209

$17.391

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IDEA Electronic Components Group

UK . 2,351 parts In-Stock

1+ parts

$21.209

100+ parts

$20.149

1k+ parts

$19.088

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2,351

$21.209

$20.149

$19.088

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Corphita

USA . 630 parts In-Stock

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630

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Corohmni

South Africa . 251 parts In-Stock

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251

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Overview

Unlock the power of efficient energy management with the UCC3911-3DP by Texas Instruments. Designed with quality and precision in mind, this Power Management IC offers a range of benefits for various applications. With its small outline package and commercial-grade temperature grade, this product ensures reliable performance while maximizing energy efficiency. Trust Texas Instruments to deliver cutting-edge solutions that cater to your power supply support circuit needs. Experience the difference with the UCC3911-3DP and revolutionize your power management systems today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable makes it easier to integrate this Power Management IC into circuit boards, reducing assembly time and cost.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, enabling compact and streamlined designs.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this Power Management IC can withstand demanding operating conditions without overheating.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making it suitable for a wide range of applications.

Width (mm): 3.9 mm

The slim width of 3.9 mm allows for space-efficient placement on the circuit board, ideal for compact or densely populated designs.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range means this Power Management IC is suitable for a wide range of commercial applications.

Technical Specifications

Power Management ICs UCC3911-3DP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

LOW INTERNAL FET SWITCH VOLTAGE DROP

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

Length:

9.89 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

UCC3911-3DP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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