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UCC3831N

Texas Instruments

UCC3831N by Texas Instruments

UCC3831N by Texas Instruments is a Power Management IC with 28 terminals and a supply voltage range of 4.5V to 8V. It operates in temperatures from 0°C to 70°C, making it suitable for commercial applications requiring power supply support circuits. The IC utilizes BICMOS technology and has a rectangular package style with dimensions of 36.22mm x 15.24mm x 5.33mm (LxWxH).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,997 parts In-Stock

1+ parts

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2,997

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Digiode

USA . 528 parts In-Stock

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528

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 140 parts In-Stock

1+ parts

$3.500

100+ parts

-

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140

$3.500

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Semicontronic

India . 1,023 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

1,023

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 683 parts In-Stock

1+ parts

$6.500

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-

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683

$6.500

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Parana Technologies

USA . 1,350 parts In-Stock

1+ parts

$14.187

100+ parts

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1k+ parts

$14.643

10k+ parts

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1,350

$14.187

-

$14.643

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DigiPath Technology Company

USA . 714 parts In-Stock

1+ parts

$15.621

100+ parts

-

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714

$15.621

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ChromeModa Solutions

Germany . 959 parts In-Stock

1+ parts

$15.940

100+ parts

$13.071

1k+ parts

-

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959

$15.940

$13.071

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IDEA Electronic Components Group

UK . 272 parts In-Stock

1+ parts

$15.940

100+ parts

$15.143

1k+ parts

$14.346

10k+ parts

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272

$15.940

$15.143

$14.346

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AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$19.249

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750

$19.249

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Advanced Electronics

New Zealand . 77 parts In-Stock

1+ parts

$22.035

100+ parts

$20.052

1k+ parts

$18.069

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77

$22.035

$20.052

$18.069

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Corphita

USA . 2,177 parts In-Stock

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2,177

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Corohmni

South Africa . 397 parts In-Stock

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397

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A-Plus Industry Inc.

USA . 4 parts In-Stock

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4

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Overview

Discover the power of innovation with the UCC3831N by Texas Instruments. This Power Management IC offers unparalleled quality and reliability, crafted by a trusted manufacturer with a solid reputation in the industry. Ideal for a wide range of applications, this product provides value and benefits that exceed expectations. Experience efficiency and performance like never before with the UCC3831N, setting new standards in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness.

Nominal Supply Voltage (Vsup): 5 V

This voltage level is commonly used in many electronic devices, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability in various environmental conditions.

Width (mm): 15.24 mm

Compact width allows for space-saving integration in electronic systems.

Technology: BICMOS

Utilizing BICMOS technology results in efficient power management with low power consumption.

Technical Specifications

Power Management ICs UCC3831N attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T28

Length:

36.22 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/8.0

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

15.24 mm

Trade Compliance

UCC3831N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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