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UCC3911-4DP

Texas Instruments

UCC3911-4DP by Texas Instruments

UCC3911-4DP by Texas Instruments is a Power Management IC with 16 terminals in a small outline package. It operates b/w -20°C to 70°C, making it suitable for commercial applications. With gull wing terminals and a rectangular shape, it supports power supply circuits efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,031 parts In-Stock

1+ parts

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8,031

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Digiode

USA . 785 parts In-Stock

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785

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Distributors (Availability)

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One Stop Electronics

USA . 776 parts In-Stock

1+ parts

$2.500

100+ parts

-

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776

$2.500

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Semicontronic

India . 812 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

812

$5.500

$5.362

$5.335

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Parana Technologies

USA . 2,149 parts In-Stock

1+ parts

$7.046

100+ parts

-

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$7.586

10k+ parts

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2,149

$7.046

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$7.586

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DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

$7.759

100+ parts

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2,347

$7.759

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IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$7.917

100+ parts

-

1k+ parts

$7.125

10k+ parts

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1,478

$7.917

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$7.125

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ChromeModa Solutions

Germany . 995 parts In-Stock

1+ parts

$7.917

100+ parts

$6.492

1k+ parts

-

10k+ parts

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995

$7.917

$6.492

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AZTECH Wire

Italy . 757 parts In-Stock

1+ parts

$17.340

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757

$17.340

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Corphita

USA . 2,295 parts In-Stock

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2,295

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Corohmni

South Africa . 177 parts In-Stock

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177

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Overview

Enhance your power management solutions with the UCC3911-4DP by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable Power Management ICs that are perfect for a variety of applications. Designed with a small outline package and gull wing terminals, this POWER SUPPLY SUPPORT CIRCUIT offers customers the value of efficient energy management in a compact design. Trust Texas Instruments to provide the innovation and performance you need for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts and maximizes space efficiency.

No. of Terminals: 16

Ample number of terminals provide flexibility for connecting various components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package saves board space and enables compact designs in electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in cold environments without risking damage to the IC.

Terminal Position: DUAL

Dual terminal position provides redundancy for enhanced reliability and stability in the circuit.

Maximum Seated Height: 1.75 mm

Low seated height enables slim and sleek designs in electronic products, especially where space is limited.

Width (mm): 3.9 mm

Narrow width facilitates dense packing of components on the PCB, optimizing use of available space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit ensures stable and efficient power delivery to connected devices, enhancing overall performance.

Length: 9.89 mm

Optimal length for compatibility with standard PCB sizes and layouts, making integration seamless.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for use in standard commercial applications, providing consistent performance.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical strength and ease of soldering during assembly, ensuring robust connections.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy mounting on the PCB and compatibility with industry-standard assembly processes.

Technical Specifications

Power Management ICs UCC3911-4DP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

LOW INTERNAL FET SWITCH VOLTAGE DROP

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

Length:

9.89 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

UCC3911-4DP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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