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UCC3831DW

Texas Instruments

UCC3831DW by Texas Instruments

UCC3831DW by Texas Instruments is a Power Management IC with 5 channels. It operates b/w 0-125°C, supporting supply voltages from 4.5V to 9V. Ideal for power supply support circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,946 parts In-Stock

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2,946

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Digiode

USA . 1,774 parts In-Stock

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1,774

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Distributors (Availability)

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One Stop Electronics

USA . 486 parts In-Stock

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$3.500

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486

$3.500

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Semicontronic

India . 162 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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162

$4.500

$4.388

$4.365

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Parana Technologies

USA . 127 parts In-Stock

1+ parts

$5.217

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-

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$5.830

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127

$5.217

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$5.830

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DigiPath Technology Company

USA . 1,132 parts In-Stock

1+ parts

$5.745

100+ parts

$5.285

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1,132

$5.745

$5.285

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ChromeModa Solutions

Germany . 6,533 parts In-Stock

1+ parts

$5.862

100+ parts

$4.807

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6,533

$5.862

$4.807

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IDEA Electronic Components Group

UK . 235 parts In-Stock

1+ parts

$5.862

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$5.276

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235

$5.862

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$5.276

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Ampacity Inc.

Singapore . 194 parts In-Stock

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$6.500

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194

$6.500

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AZTECH Wire

Italy . 865 parts In-Stock

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$10.854

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865

$10.854

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Corohmni

South Africa . 444 parts In-Stock

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Corphita

USA . 318 parts In-Stock

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Overview

Enhance the efficiency and performance of your power management system with the UCC3831DW by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Power Management ICs. With a wide range of applications, this product is perfect for various electronic devices. Experience the value and benefits of seamless power supply support with the UCC3831DW, providing customers with optimal functionality and peace of mind. Upgrade your power management system today and see the difference firsthand.

Feature Benefit Bullets

Nominal Supply Voltage (Vsup): 5 V

This product is designed to operate optimally with a 5V supply voltage, ensuring efficient and reliable power management.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product is suitable for applications that require high temperature resistance and reliability.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product versatile and suitable for a wide range of environments and applications.

IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC provides necessary functions for power management, making it an essential component in various electronic systems.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product is efficient in leveraging power sources with lower voltages, increasing its compatibility with different systems.

No. of Channels: 5

The availability of 5 channels allows this product to manage multiple power sources or outputs simultaneously, enhancing its versatility and utility in complex systems.

Maximum Supply Voltage (Vsup): 9 V

With a maximum supply voltage of 9V, this product offers flexibility in handling higher voltage inputs without compromising on performance or safety.

Technical Specifications

Power Management ICs UCC3831DW attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

No. of Channels:

5

No. of Functions:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Temperature Grade:

Trade Compliance

UCC3831DW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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