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UCC39002PE4

Texas Instruments

UCC39002PE4 by Texas Instruments

UCC39002PE4 by Texas Instruments is a Power Management IC with 12V nominal voltage and 8 terminals. It features BICMOS technology, adjustable threshold, and operates b/w 0-70°C. Ideal for power supply support circuits in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,521 parts In-Stock

1+ parts

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2,521

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Digiode

USA . 1,354 parts In-Stock

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1,354

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Distributors (Availability)

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One Stop Electronics

USA . 175 parts In-Stock

1+ parts

$1.500

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175

$1.500

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Semicontronic

India . 215 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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215

$3.500

$3.412

$3.395

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Parana Technologies

USA . 73 parts In-Stock

1+ parts

$4.158

100+ parts

-

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$4.603

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73

$4.158

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$4.603

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Ampacity Inc.

Singapore . 1,370 parts In-Stock

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$4.500

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1,370

$4.500

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DigiPath Technology Company

USA . 264 parts In-Stock

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$4.579

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264

$4.579

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ChromeModa Solutions

Germany . 3,187 parts In-Stock

1+ parts

$4.672

100+ parts

$3.831

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3,187

$4.672

$3.831

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IDEA Electronic Components Group

UK . 32 parts In-Stock

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$4.672

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$4.205

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32

$4.672

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$4.205

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AZTECH Wire

Italy . 188 parts In-Stock

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$8.216

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188

$8.216

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Corphita

USA . 2,458 parts In-Stock

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Corohmni

South Africa . 334 parts In-Stock

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Overview

Power up your devices with the UCC39002PE4 by Texas Instruments, a top-tier manufacturer of Power Management ICs. This high-quality product is perfect for a wide range of applications, offering reliable performance and efficiency. With a nominal supply voltage of 12V and adjustable threshold, this IC provides optimal power supply support while maintaining a compact design. Trust in Texas Instruments to deliver superior technology that exceeds expectations. Experience the value and benefits of the UCC39002PE4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power Management IC.

Nominal Supply Voltage (Vsup): 12 V

This voltage is suitable for many applications and ensures compatibility with various systems.

Minimum Operating Temperature: 0 °C

The wide operating temperature range allows the Power Management IC to function effectively in various environments.

Maximum Seated Height: 5.08 mm

The compact size of the IC makes it suitable for space-constrained applications.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Power Management ICs UCC39002PE4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.81 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3.5 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UCC39002PE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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