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LM809M3X-4.38/NOPB

Texas Instruments

LM809M3X-4.38/NOPB by Texas Instruments

LM809M3X-4.38/NOPB by Texas Instruments is a power management IC with a nominal voltage of 3V and a max operating temperature of 105°C. It is commonly used as a power supply support circuit in industrial applications.

Median Price

$0.672

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 305,788 parts In-Stock

1+ parts

$0.543

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$0.418

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$0.220

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305,788

$0.543

$0.418

$0.220

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Mouser Electronics

USA . 2,850 parts In-Stock

1+ parts

$0.800

100+ parts

$0.453

1k+ parts

$0.390

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$0.361

2,850

$0.800

$0.453

$0.390

$0.361

DigiKey

USA . 1,429 parts In-Stock

1+ parts

$0.800

100+ parts

$0.453

1k+ parts

$0.389

10k+ parts

$0.357

1,429

$0.800

$0.453

$0.389

$0.357

Chip1Stop

Japan . 3,000 parts In-Stock

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-

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-

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$0.269

3,000

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$0.269

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.343

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-

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600

$0.343

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Digiode

USA . 1,189 parts In-Stock

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$0.516

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1,189

$0.516

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Vyrian

USA . 103,224 parts In-Stock

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103,224

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Chip Stock

USA . 39,100 parts In-Stock

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Sensible Micro Corp

USA . 16,000 parts In-Stock

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16,000

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Martec Srl

Italy . 7,177 parts In-Stock

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7,177

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Bristol Electronics

USA . 6,721 parts In-Stock

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6,721

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Cyclops Electronics Ltd

UK . 5,311 parts In-Stock

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Anansix

USA . 2,595 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 103,130 parts In-Stock

1+ parts

$0.229

100+ parts

$0.223

1k+ parts

$0.222

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103,130

$0.229

$0.223

$0.222

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Ampacity Inc.

Singapore . 102,948 parts In-Stock

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$0.229

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102,948

$0.229

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Argo Parts USA

USA . 3,881 parts In-Stock

1+ parts

$0.343

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$0.333

3,881

$0.343

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-

$0.333

Continental Prestige Electronics

USA . 2,689 parts In-Stock

1+ parts

$0.343

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$0.336

2,689

$0.343

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$0.336

Netroflash

USA . 2,000 parts In-Stock

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$0.343

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2,000

$0.343

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

1+ parts

$0.381

100+ parts

$0.377

1k+ parts

$0.366

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1,000

$0.381

$0.377

$0.366

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Corphita

USA . 5,013 parts In-Stock

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$0.489

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$0.489

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Parana Technologies

USA . 1,953 parts In-Stock

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$7.429

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$7.916

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$7.429

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$7.916

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Corohmni

South Africa . 137 parts In-Stock

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$7.874

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137

$7.874

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DigiPath Technology Company

USA . 1,443 parts In-Stock

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$8.180

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$7.526

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$8.180

$7.526

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IDEA Electronic Components Group

UK . 2,240 parts In-Stock

1+ parts

$8.347

100+ parts

$7.930

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$7.512

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2,240

$8.347

$7.930

$7.512

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ChromeModa Solutions

Germany . 797 parts In-Stock

1+ parts

$8.347

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$6.845

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797

$8.347

$6.845

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$18.756

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$17.068

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$15.380

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$18.756

$17.068

$15.380

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A-Z Elektronik GmbH

Germany . 9,768 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,512 parts In-Stock

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4,512

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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$5.118

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$5.118

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$5.118

950

-

$5.118

$5.118

$5.118

Lixinc

USA . 127 parts In-Stock

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127

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Overview

Discover the LM809M3X-4.38/NOPB, a high-quality Power Management IC manufactured by Texas Instruments. This compact and versatile product offers numerous benefits and advantages to customers. With its wide temperature range and low supply voltage, it is perfect for industrial applications. Its small outline and thin profile make it easy to integrate into various circuits. Trust in Texas Instruments' reputation for excellence and choose the LM809M3X-4.38/NOPB for your power supply support needs. Experience reliable performance and efficient power management with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body of this power management IC ensures durability and resistance to various environmental conditions, making it a reliable choice for long-term usage.

Surface Mount: YES

This power management IC is designed for surface mount applications, allowing for easy and efficient installation onto circuit boards, reducing assembly time and costs.

No. of Functions: 1

With a single function, this power management IC focuses on delivering efficient and reliable power management capabilities, simplifying system designs and ensuring optimal performance.

Package Shape: RECTANGULAR

The rectangular shape of the package offers versatility in placement and integration within various electronic systems, providing ease of use and flexibility in design.

Nominal Supply Voltage (Vsup): 3 V

With a nominal supply voltage of 3 V, this power management IC is compatible with a wide range of devices and systems, offering efficient power management for different applications.

Power Supplies (V): 1.2/5.5

This power management IC supports power supplies ranging from 1.2 V to 5.5 V, providing flexibility in power source options and accommodating a variety of electronic components and devices.

No. of Terminals: 3

Featuring three terminals, this power management IC offers simplified connectivity and efficient power distribution, contributing to a streamlined system design and reliable operation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this power management IC enables space-saving integration within compact electronic devices, making it an excellent choice for miniaturized applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, this power management IC can withstand harsh environments, ensuring stable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability of -40 °C allows this power management IC to operate effectively in extremely cold environments, expanding its applicability to various industries and regions.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish enhances solderability and durability, ensuring reliable connections and enhancing the overall performance and lifespan of the power management IC.

Terminal Position: DUAL

The dual terminal position enables efficient electrical connections, ensuring proper power distribution and minimizing signal losses, making this power management IC a reliable choice for seamless circuit integration.

Maximum Seated Height: 1.12 mm

With a maximum seated height of 1.12 mm, this power management IC offers a compact and low-profile design, ideal for space-constrained applications while maintaining efficiency and effective power management capabilities.

Width (mm): 1.3 mm

The compact width of 1.3 mm enables easy integration and placement within electronic systems, providing flexibility in design and enhancing overall system miniaturization.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC serves as a power supply support circuit, effectively regulating and managing power to ensure stable and reliable operation of connected devices, making it a dependable choice for power management applications.

Minimum Supply Voltage (Vsup): 1.2 V

With a minimum supply voltage of 1.2 V, this power management IC accommodates low-power applications, delivering efficient power management and reliable performance for a wide range of devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260°C ensures the power management IC can undergo the standard solder reflow process, simplifying assembly and ensuring secure connections in electronic systems.

Length: 2.92 mm

The compact length of 2.92 mm enables easy integration within electronic systems, providing versatility in design and compatibility with various device form factors.

Nominal Threshold Voltage (V): +4.38V

With a nominal threshold voltage of +4.38V, this power management IC ensures accurate and precise voltage regulation, enabling reliable power supply and optimized performance in connected devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this power management IC operates reliably in challenging environments, offering extended temperature range and robustness for critical systems.

Maximum Supply Current (Isup): 0.1 mA

With a maximum supply current of 0.1 mA, this power management IC minimizes power consumption, making it energy-efficient and suitable for battery-powered devices or applications requiring low power consumption.

No. of Channels: 1

Featuring a single channel, this power management IC simplifies system design and provides efficient power management for individual devices or components, ensuring optimal performance and ease of integration.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this power management IC offers low power consumption, high reliability, and compatibility with a wide range of electronic devices, making it a versatile and efficient choice.

Terminal Form: GULL WING

The gull wing terminal form allows for secure and reliable surface mount soldering, providing robust electrical connections and minimizing the risk of signal loss or disconnection in this power management IC.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95 mm, this power management IC supports efficient and accurate soldering, ensuring reliable electrical connections for seamless integration within electronic systems.

Moisture Sensitivity Level (MSL): 1

With an MSL level of 1, this power management IC features a low moisture sensitivity, making it resistant to moisture-related damage during storage and assembly processes, enhancing its reliability and longevity.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of handling a maximum supply voltage of 5.5 V, this power management IC offers versatility in power source options, accommodating a wide range of electronic systems and devices.

Technical Specifications

Power Management ICs LM809M3X-4.38/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.38V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.3 mm

Trade Compliance

LM809M3X-4.38/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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