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TVP3026-250APCE

Texas Instruments

TVP3026-250APCE by Texas Instruments

TVP3026-250APCE by Texas Instruments is a display controller with 1280x1024 pixel config, 8-bit data bus, and 14.31818 MHz clock freq. It's used in commercial applications for driving displays with a supply voltage range of 4.75V to 5.25V and operating temp from 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,828 parts In-Stock

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4,828

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Digiode

USA . 3,646 parts In-Stock

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3,646

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$8.604

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875

$8.604

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One Stop Electronics

USA . 583 parts In-Stock

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$20.000

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583

$20.000

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Parana Technologies

USA . 1,432 parts In-Stock

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$22.591

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$23.248

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1,432

$22.591

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$23.248

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DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$24.875

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650

$24.875

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ChromeModa Solutions

Germany . 4,288 parts In-Stock

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$25.383

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$20.814

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4,288

$25.383

$20.814

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IDEA Electronic Components Group

UK . 1,344 parts In-Stock

1+ parts

$25.383

100+ parts

$24.114

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$22.845

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1,344

$25.383

$24.114

$22.845

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Corohmni

South Africa . 208 parts In-Stock

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$81.681

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Corphita

USA . 2,508 parts In-Stock

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Overview

Enhance your display experience with the TVP3026-250APCE by Texas Instruments, a top-quality display controller designed to deliver exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications. With its advanced technology and innovative design, the TVP3026-250APCE offers customers unparalleled value, benefits, and advantages. Upgrade your display system today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy installation and enables compact design of electronic devices.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage ensures stable operation and provides flexibility in power supply options.

Address Bus Width: 4

A wider address bus width allows for efficient data transfer and processing capabilities.

No. of Terminals: 160

Having a high number of terminals provides connectivity options for various external components and peripherals.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in colder environments.

Display Config: 1280 X 1024 PIXELS

High display resolution enables crisp and detailed visuals for enhanced user experience.

Maximum Clock Frequency: 14.31818 MHz

A high clock frequency allows for fast data processing and efficient operation of the display controller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and good support for various logic functions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard and widely supported voltage level in electronic devices.

Technical Specifications

Display Controllers TVP3026-250APCE attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G160

Length:

28 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TVP3026-250APCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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