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TVP3026-230BPCE

Texas Instruments

TVP3026-230BPCE by Texas Instruments

TVP3026-230BPCE by Texas Instruments is a display controller with 1280x1024 pixels, 8-bit data bus, and 14.31818 MHz clock frequency. It is used in commercial applications for driving displays with a resolution of up to 1280x1024 pixels at temperatures ranging from 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,257 parts In-Stock

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Vyrian

USA . 3,089 parts In-Stock

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3,089

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Distributors (Availability)

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AZTECH Wire

Italy . 547 parts In-Stock

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$8.947

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$8.947

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One Stop Electronics

USA . 1,308 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 281 parts In-Stock

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$72.154

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$72.154

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DigiPath Technology Company

USA . 1,721 parts In-Stock

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$79.451

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1,721

$79.451

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ChromeModa Solutions

Germany . 5,674 parts In-Stock

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$81.072

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$66.479

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$81.072

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IDEA Electronic Components Group

UK . 2,147 parts In-Stock

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$81.072

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$77.018

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$72.965

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2,147

$81.072

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$72.965

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Corphita

USA . 4,993 parts In-Stock

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Overview

Unlock the potential of your display with the Texas Instruments TVP3026-230BPCE Display Controller. Crafted by a trusted manufacturer, this product offers seamless integration, high-quality performance, and reliable operation. Ideal for a wide range of applications, this controller delivers crisp visuals and smooth operation, maximizing the value and benefits for customers. Upgrade your display system with the TVP3026-230BPCE and experience unparalleled quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the display controller easy to handle and install.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for safe and efficient operation in various power supply setups.

Address Bus Width: 4

A wider address bus width enables the controller to handle larger amounts of data efficiently, improving overall performance.

Minimum Supply Voltage: 4.75 V

Having a relatively low minimum supply voltage ensures compatibility with a wide range of power sources.

Display Config: 1280 X 1024 PIXELS

High display configuration allows for crisp and clear resolution, making it ideal for detailed and high-quality image rendering.

Maximum Clock Frequency: 14.31818 MHz

High maximum clock frequency enables fast data processing and refresh rates, leading to smooth and responsive display performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard temperature environments, suitable for various commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the display controller.

Technical Specifications

Display Controllers TVP3026-230BPCE attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G160

Length:

28 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TVP3026-230BPCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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