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TVP3026-175BMDN

Texas Instruments

TVP3026-175BMDN by Texas Instruments

TVP3026-175BMDN by Texas Instruments is a Display Controller with 1280x1024 resolution, 8-bit data bus, and 14.31818 MHz clock frequency. Ideal for commercial applications, it operates b/w 0-70°C temperature range and supports a max supply voltage of 5.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,732 parts In-Stock

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8,732

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Digiode

USA . 1,385 parts In-Stock

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1,385

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Distributors (Availability)

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AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$11.518

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840

$11.518

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One Stop Electronics

USA . 1,562 parts In-Stock

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$20.000

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Parana Technologies

USA . 1,770 parts In-Stock

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$23.461

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$24.094

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$23.461

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$24.094

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ChromeModa Solutions

Germany . 1,478 parts In-Stock

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$26.361

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$21.616

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1,478

$26.361

$21.616

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IDEA Electronic Components Group

UK . 1,459 parts In-Stock

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$26.361

100+ parts

$25.043

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$23.725

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1,459

$26.361

$25.043

$23.725

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Corohmni

South Africa . 147 parts In-Stock

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$53.245

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147

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Corphita

USA . 1,767 parts In-Stock

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DigiPath Technology Company

USA . 14 parts In-Stock

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$23.767

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Overview

Elevate your display experience with the TVP3026-175BMDN by Texas Instruments, a top-tier manufacturer known for its quality products in the Display Controllers category. Designed for high performance and reliability, this product offers seamless integration and exceptional visual output. Perfect for a wide range of applications, this display controller delivers unparalleled value, benefits, and advantages to customers seeking cutting-edge technology for their projects. Experience the difference with Texas Instruments and take your display to the next level.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body material provides durability and protection to the display controller, ensuring a longer lifespan of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making it convenient for manufacturers to integrate this display controller into their products.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this display controller can accommodate varying power requirements, making it versatile for different applications.

Address Bus Width: 4

A wider address bus width allows for efficient communication between the display controller and other components, enhancing overall performance.

Package Shape: SQUARE

The square package shape makes it easier to mount and integrate this display controller into electronic devices, optimizing space utilization.

No. of Terminals: 160

Having a higher number of terminals provides more connectivity options, enabling seamless integration with other hardware components in a system.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and streamlined design, ideal for applications where space is limited.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage of 4.75 V ensures reliable operation even under low power conditions, making this display controller suitable for a wide range of environments.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this display controller can withstand heat and function optimally in demanding conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the display controller remains functional even in cold environments.

Terminal Position: QUAD

The quad terminal position enhances connectivity options and facilitates easy integration of the display controller into circuitry.

Display Config: 1280 X 1024 PIXELS

With a high display resolution of 1280 x 1024 pixels, this display controller delivers sharp and clear images for an enhanced viewing experience.

Maximum Seated Height: 4.07 mm

The low maximum seated height of 4.07 mm allows for a slim profile design, making it suitable for applications where space constraints are a concern.

Width: 27.64 mm

The compact width of 27.64 mm enables easy integration into electronic devices without occupying excessive space.

External Data Bus Width: 8

An external data bus width of 8 facilitates high-speed data transfer between the display controller and external peripherals, enhancing overall system performance.

Maximum Clock Frequency: 14.31818 MHz

The high maximum clock frequency of 14.31818 MHz ensures rapid data processing, reducing latency and improving the responsiveness of the display controller.

Length: 27.64 mm

The length of 27.64 mm is compact, making this display controller suitable for applications where space-saving is crucial.

Temperature Grade: COMMERCIAL

Designed for commercial use, this display controller meets industry standards for reliability and performance in commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Supporting a display controller and palette DAC (Digital-to-Analog Converter) functionality, this product offers versatile display capabilities for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, making this display controller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this display controller operates efficiently within standard voltage requirements, making it compatible with a wide range of power sources.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for dense packaging, enabling a higher number of terminals within a compact space for enhanced connectivity options.

Technical Specifications

Display Controllers TVP3026-175BMDN attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-MQFP-G160

Length:

27.64 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.07 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

27.64 mm

Peripheral IC Type:

Trade Compliance

TVP3026-175BMDN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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