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XDLPC3421ZVB

Texas Instruments

XDLPC3421ZVB by Texas Instruments

XDLPC3421ZVB by Texas Instruments is a display controller with 854x480 pixels, operating at 24.002 MHz clock frequency. It features a thin profile package style with 176 terminals and supports I2C and SPI bus compatibility. Ideal for applications requiring high-resolution displays in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,853 parts In-Stock

1+ parts

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2,853

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Vyrian

USA . 2,147 parts In-Stock

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2,147

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,422 parts In-Stock

1+ parts

$14.000

100+ parts

-

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1,422

$14.000

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Parana Technologies

USA . 2,107 parts In-Stock

1+ parts

$16.485

100+ parts

-

1k+ parts

$16.777

10k+ parts

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2,107

$16.485

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$16.777

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AZTECH Wire

Italy . 796 parts In-Stock

1+ parts

$17.610

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796

$17.610

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$18.522

100+ parts

$17.596

1k+ parts

$16.670

10k+ parts

-

1,139

$18.522

$17.596

$16.670

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ChromeModa Solutions

Germany . 1,121 parts In-Stock

1+ parts

$18.522

100+ parts

$15.188

1k+ parts

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1,121

$18.522

$15.188

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Corohmni

South Africa . 76 parts In-Stock

1+ parts

$81.772

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76

$81.772

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DigiPath Technology Company

USA . 1,548 parts In-Stock

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100+ parts

$16.699

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1,548

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$16.699

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Corphita

USA . 506 parts In-Stock

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506

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Overview

Experience high-quality display control with the XDLPC3421ZVB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this display controller. Ideal for a wide range of applications, this product offers customers value, benefits, and advantages that set it apart from the competition. Upgrade your display experience with the XDLPC3421ZVB and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the display controller easy to handle and resistant to damage.

Maximum Supply Voltage: 1.155 V

This allows for reliable and stable operation within the specified voltage range.

Package Shape: SQUARE

The square shape of the package makes it easy to mount and integrate into a variety of devices and systems.

Display Config: 854 X 480 PIXELS

With a high resolution display configuration, this controller can deliver sharp and clear images on the connected display.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, resulting in efficient and reliable operation.

Bus Compatibility: I2C, SPI

Support for I2C and SPI interfaces ensures compatibility with a wide range of devices and systems, allowing for easy integration.

Technical Specifications

Display Controllers XDLPC3421ZVB attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Bus Compatibility:

I2C, SPI

Maximum Clock Frequency:

24.002 MHz

Display Config:

854 X 480 PIXELS

External Data Bus Width:

24

JESD-30 Code:

S-PBGA-B176

Length:

7 mm

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA176,15X15,16

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

XDLPC3421ZVB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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