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TSB41BA3BIPFP

Texas Instruments

TSB41BA3BIPFP by Texas Instruments

TSB41BA3BIPFP by Texas Instruments is a Serial Communication Controller with 80 terminals, operating at -40 to 85 °C. It supports data transfer rates up to 50 MBps and clock frequencies of 49.152 MHz. Ideal for industrial applications requiring low power consumption and high-speed serial I/O communication.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,242 parts In-Stock

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7,242

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Digiode

USA . 4,028 parts In-Stock

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4,028

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Distributors (Availability)

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One Stop Electronics

USA . 822 parts In-Stock

1+ parts

$11.000

100+ parts

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822

$11.000

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Parana Technologies

USA . 1,862 parts In-Stock

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$14.682

100+ parts

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$15.125

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1,862

$14.682

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$15.125

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DigiPath Technology Company

USA . 397 parts In-Stock

1+ parts

$16.167

100+ parts

$14.874

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397

$16.167

$14.874

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ChromeModa Solutions

Germany . 6,472 parts In-Stock

1+ parts

$16.497

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$13.528

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6,472

$16.497

$13.528

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$16.497

100+ parts

$15.672

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$14.847

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1,390

$16.497

$15.672

$14.847

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AZTECH Wire

Italy . 898 parts In-Stock

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$18.053

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898

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Corphita

USA . 3,469 parts In-Stock

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Overview

Discover the TSB41BA3BIPFP by Texas Instruments, a top-of-the-line Serial Communication Controller that offers unparalleled quality and reliability. Manufactured by the renowned Texas Instruments, this product ensures superior performance in various applications. With a maximum data transfer rate of 50 MBps, low power mode, and a wide external data bus width of 8, this controller is a game-changer in the industry. Experience seamless communication and efficient data transfer with the TSB41BA3BIPFP, providing customers with unmatched value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 2 V

Ensures compatibility with a wide range of power sources.

Address Bus Width: 2

Sufficient bus width for addressing tasks in communication control.

Package Shape: SQUARE

Provides a compact form factor that can fit well in tight spaces.

No. of Terminals: 80

Sufficient terminals for connecting to various components in a communication setup.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Offers versatility in mounting options to accommodate different design requirements.

Minimum Supply Voltage: 1.75 V

Allows for operation at a lower voltage, which can be beneficial for power efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where elevated temperatures may be present.

Maximum Data Transfer Rate: 50 MBps

Provides high-speed data transfer capabilities for efficient communication tasks.

Minimum Operating Temperature: -40 °C

Can withstand cold environments, making it versatile in different operating conditions.

Terminal Position: QUAD

Quad terminals offer a secure and stable connection for reliable performance.

Maximum Seated Height: 1.2 mm

Low profile design for space-saving installation in compact devices.

Width: 12 mm

Compact width for fitting into narrow spaces or crowded circuit layouts.

External Data Bus Width: 8

Sufficient width for transferring data between components efficiently.

Maximum Clock Frequency: 49.152 MHz

Fast clock frequency for rapid processing of data in communication tasks.

Length: 12 mm

Compact length for space-efficient integration into electronic systems.

Temperature Grade: INDUSTRIAL

Designed to withstand the demanding conditions of industrial environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specialized for serial communication tasks, providing efficient control and data transfer capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections for stable performance.

Nominal Supply Voltage: 1.85 V

Optimal voltage level for efficient and reliable operation of the controller.

No. of Serial I/Os: 3

Multiple serial I/O ports for versatile connectivity options in communication setups.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and precise connections in circuit layouts.

Low Power Mode: YES

Includes a low power mode option for energy-efficient operation in power-sensitive applications.

Technical Specifications

Serial Communication Controllers TSB41BA3BIPFP attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

49.152 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of Serial I/Os:

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.75 V

Nominal Supply Voltage:

1.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TSB41BA3BIPFP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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