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TSB41BA3BTPFPEP

Texas Instruments

TSB41BA3BTPFPEP by Texas Instruments

TSB41BA3BTPFPEP by Texas Instruments is a Serial Communication Controller with 80 terminals, operating at -40 to 110 °C. It supports IEEE1394 protocol, offers data rates up to 50 MBps, and has low power mode. Ideal for industrial applications requiring high-speed communication in compact form factor.

Median Price

$46.860

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,116 parts In-Stock

1+ parts

$43.372

100+ parts

$38.553

1k+ parts

$28.348

10k+ parts

-

44,116

$43.372

$38.553

$28.348

-

DigiKey

USA . 50 parts In-Stock

1+ parts

$71.250

100+ parts

$54.361

1k+ parts

-

10k+ parts

-

50

$71.250

$54.361

-

-

Mouser Electronics

USA . 43 parts In-Stock

1+ parts

$71.250

100+ parts

$52.660

1k+ parts

-

10k+ parts

-

43

$71.250

$52.660

-

-

Avnet

USA . 226 parts In-Stock

1+ parts

-

100+ parts

$43.339

1k+ parts

$38.921

10k+ parts

-

226

-

$43.339

$38.921

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Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$46.860

1k+ parts

$41.930

10k+ parts

$39.460

8

-

$46.860

$41.930

$39.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,314 parts In-Stock

1+ parts

$41.203

100+ parts

-

1k+ parts

-

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2,314

$41.203

-

-

-

Vyrian

USA . 4,836 parts In-Stock

1+ parts

-

100+ parts

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4,836

-

-

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North Shore Components

USA . 13 parts In-Stock

1+ parts

-

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,618 parts In-Stock

1+ parts

$27.476

100+ parts

-

1k+ parts

$36.333

10k+ parts

-

1,618

$27.476

-

$36.333

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ChromeModa Solutions

Germany . 2,654 parts In-Stock

1+ parts

$30.872

100+ parts

$25.315

1k+ parts

-

10k+ parts

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2,654

$30.872

$25.315

-

-

IDEA Electronic Components Group

UK . 605 parts In-Stock

1+ parts

$30.872

100+ parts

$29.328

1k+ parts

$27.785

10k+ parts

-

605

$30.872

$29.328

$27.785

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Corphita

USA . 2,966 parts In-Stock

1+ parts

$39.035

100+ parts

-

1k+ parts

-

10k+ parts

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2,966

$39.035

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Lixinc

USA . 13,802 parts In-Stock

1+ parts

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100+ parts

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13,802

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DigiPath Technology Company

USA . 971 parts In-Stock

1+ parts

-

100+ parts

$27.834

1k+ parts

-

10k+ parts

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971

-

$27.834

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Perfect Parts

USA . 959 parts In-Stock

1+ parts

-

100+ parts

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959

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Overview

Experience seamless and efficient data transfer with the TSB41BA3BTPFPEP by Texas Instruments. Built with precision and reliability, this Serial Communication Controller offers unparalleled performance in various applications. From industrial automation to consumer electronics, this product ensures high-speed communication with a maximum data transfer rate of 50 MBps. Trust in Texas Instruments' expertise in technology to deliver a quality product that exceeds expectations. Upgrade your systems today with the TSB41BA3BTPFPEP and enjoy the benefits of faster data processing and reliable connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection to the controller, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 2 V

The high maximum supply voltage of 2V allows for flexibility in power input, catering to a range of applications.

Package Shape: SQUARE

The square package shape offers a compact design, making it easy to fit into tight spaces within electronic devices.

No. of Terminals: 80

With a high number of terminals, there are ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature ensures reliable performance even in harsh and hot environments.

Maximum Data Transfer Rate: 50 MBps

The high data transfer rate enables fast and efficient communication, essential for real-time applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the controller to function in extremely cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the controller energy-efficient and reliable.

Technical Specifications

Serial Communication Controllers TSB41BA3BTPFPEP attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Boundary Scan:

NO

Maximum Clock Frequency:

49.152 MHz

Communication Protocol:

IEEE1394

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

3

No. of Terminals:

80

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.75 V

Nominal Supply Voltage:

1.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB41BA3BTPFPEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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