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TSB41BA3BPFP

Texas Instruments

TSB41BA3BPFP by Texas Instruments

TSB41BA3BPFP by Texas Instruments is a Serial Communication Controller with 80 terminals, operating at 0-70°C. It supports IEEE1394 protocol, offers 50 MBps data transfer rate, and has low power mode. Ideal for applications requiring high-speed serial communication in commercial-grade environments.

Median Price

$10.920

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$8.014

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$8.014

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Verical

USA . 7 parts In-Stock

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$8.014

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7

$8.014

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Chip1Stop

Japan . 7 parts In-Stock

1+ parts

$15.000

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7

$15.000

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DigiKey

USA . 26 parts In-Stock

1+ parts

$20.680

100+ parts

$13.620

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26

$20.680

$13.620

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$10.920

1k+ parts

$9.770

10k+ parts

$9.190

2

-

$10.920

$9.770

$9.190

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,405 parts In-Stock

1+ parts

$7.613

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$7.613

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Vyrian

USA . 3,513 parts In-Stock

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3,513

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QIE Inc.

USA . 165 parts In-Stock

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Inventory MP

USA . 12 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,757 parts In-Stock

1+ parts

$7.213

100+ parts

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1,757

$7.213

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Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$14.830

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10

$14.830

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Parana Technologies

USA . 1,613 parts In-Stock

1+ parts

$34.646

100+ parts

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1,613

$34.646

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ChromeModa Solutions

Germany . 2,148 parts In-Stock

1+ parts

$38.928

100+ parts

$31.921

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2,148

$38.928

$31.921

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IDEA Electronic Components Group

UK . 1,151 parts In-Stock

1+ parts

$38.928

100+ parts

$36.982

1k+ parts

$35.035

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1,151

$38.928

$36.982

$35.035

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Microchip USA

USA . 1,120 parts In-Stock

1+ parts

$52.892

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1,120

$52.892

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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DigiPath Technology Company

USA . 1,093 parts In-Stock

1+ parts

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$35.097

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1,093

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$35.097

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Kepictronics

USA . 860 parts In-Stock

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860

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Perfect Parts

USA . 430 parts In-Stock

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430

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Overview

Upgrade your serial communication systems with the TSB41BA3BPFP by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers cutting-edge technology in the form of this advanced Serial Communication Controller. Ideal for a wide range of applications, this product offers customers unparalleled value and benefits, including lightning-fast data transfer rates of up to 50 MBps, low power mode capabilities, and seamless integration into existing systems. Trust Texas Instruments to provide the innovative solutions you need for your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat and moisture, making the product suitable for various environments.

Maximum Supply Voltage: 2 V

A maximum supply voltage of 2V ensures safe operation without exceeding the designated power input.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate of 50MBps allows for quick and efficient communication between devices.

Communication Protocol: IEEE1394

Utilization of IEEE1394 protocol ensures reliable and standardized communication interface.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Serial Communication Controllers TSB41BA3BPFP attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

49.152 MHz

Communication Protocol:

IEEE1394

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

3

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TSB41BA3BPFP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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