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TSB42AC3PZTG4

Texas Instruments

TSB42AC3PZTG4 by Texas Instruments

TSB42AC3PZTG4 by Texas Instruments is a Serial Communication Controller with 8-bit address bus width, 50 MBps data transfer rate, and 50 MHz clock frequency. Ideal for applications requiring high-speed asynchronous communication protocols in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,547 parts In-Stock

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5,547

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Digiode

USA . 405 parts In-Stock

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$16.159

100+ parts

-

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537

$16.159

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One Stop Electronics

USA . 225 parts In-Stock

1+ parts

$27.000

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225

$27.000

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Parana Technologies

USA . 1,230 parts In-Stock

1+ parts

$39.346

100+ parts

$3,653.874

1k+ parts

$35.411

10k+ parts

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1,230

$39.346

$3,653.874

$35.411

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DigiPath Technology Company

USA . 1,558 parts In-Stock

1+ parts

$43.325

100+ parts

$39.859

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1,558

$43.325

$39.859

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ChromeModa Solutions

Germany . 6,965 parts In-Stock

1+ parts

$44.209

100+ parts

$36.251

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6,965

$44.209

$36.251

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IDEA Electronic Components Group

UK . 2,221 parts In-Stock

1+ parts

$44.209

100+ parts

$41.999

1k+ parts

$39.788

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2,221

$44.209

$41.999

$39.788

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Corphita

USA . 815 parts In-Stock

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815

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Overview

Enhance your communication systems with the TSB42AC3PZTG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality products that deliver exceptional performance. This Serial Communication Controller is perfect for a wide range of applications, offering seamless data transfer and reliable connectivity. With a maximum data transfer rate of 50 MBps and a maximum clock frequency of 50 MHz, this controller ensures efficient operation. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TSB42AC3PZTG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and contamination resistance, making the product suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Operates at a safe and efficient voltage level, ensuring stability and reliability.

Address Bus Width: 8

Address Bus Width of 8 allows for efficient data handling and processing.

Power Supplies (V): 3.3

Reliable power supply at 3.3V ensures consistent performance.

No. of Terminals: 100

Sufficient number of terminals for connecting to other components and peripherals.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for usage in a wide range of environments.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate enables fast and efficient communication.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder conditions.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for fast data processing and communication.

Technical Specifications

Serial Communication Controllers TSB42AC3PZTG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TSB42AC3PZTG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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