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TSB42AA9IPZT

Texas Instruments

TSB42AA9IPZT by Texas Instruments

TSB42AA9IPZT by Texas Instruments is a Serial Communication Controller with 100 terminals, operating at -40 to 85 °C. It has a supply voltage range of 3-3.6 V and comes in a low profile, fine pitch flatpack package. Ideal for industrial applications requiring serial IO/communication control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,966 parts In-Stock

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Digiode

USA . 1,674 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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AZTECH Wire

Italy . 762 parts In-Stock

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$7.864

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One Stop Electronics

USA . 763 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,166 parts In-Stock

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$56.443

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ChromeModa Solutions

Germany . 2,334 parts In-Stock

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$63.419

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$52.004

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

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$63.419

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$60.248

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$57.077

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DigiPath Technology Company

USA . 1,438 parts In-Stock

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$57.179

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Corphita

USA . 580 parts In-Stock

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Microchip USA

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unlock seamless communication with the TSB42AA9IPZT by Texas Instruments, a top-of-the-line Serial Communication Controller designed to elevate your projects to new heights. Manufactured by the trusted brand Texas Instruments, this product guarantees superior quality and reliability. Whether you're working on IoT devices, industrial automation systems, or telecommunications equipment, this controller offers unmatched performance and efficiency. Experience the value of streamlined operations, increased productivity, and enhanced connectivity with the TSB42AA9IPZT - your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and labor costs during manufacturing.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can handle higher power requirements and operate reliably in various voltage scenarios.

Package Shape: SQUARE

The square shape of the package ensures efficient use of PCB space, making it easier to integrate the product into electronic systems with limited space.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and interfaces, making the product versatile and suitable for a wide range of communication applications.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers high component density, enabling compact design and enhancing signal integrity in high-speed communication systems.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures the product can operate efficiently even in low-power situations, providing flexibility in power management.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high-temperature environments, making it ideal for industrial applications that require reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures the product is suitable for use in extreme cold environments without compromising performance.

Terminal Position: QUAD

Quad terminal position provides additional connectivity options, allowing for more diverse input/output configurations and enhancing the product's flexibility in communication setups.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45mm enables a slim and space-saving design, particularly in applications where height constraints are a concern.

Width: 14 mm

The compact width of 14mm makes the product suitable for devices with limited board space, offering an optimal size-to-performance ratio.

Length: 14 mm

With a length of 14mm, the product can be easily accommodated in electronic assemblies without occupying excessive space, contributing to efficient PCB layout.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures the product can function reliably in harsh industrial environments, making it a robust and dependable choice for industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial IO/communication controller, this product provides efficient and reliable serial communication capabilities, making it suitable for various data transfer and control applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the product's energy efficiency and reliability in communication systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process during assembly, ensuring secure and reliable connections for stable communication performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable power source for the product, promoting consistent operation and performance in communication systems.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density PCB layouts and efficient signal routing, enabling the product to support high-speed data transfer and communication protocols.

Technical Specifications

Serial Communication Controllers TSB42AA9IPZT attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TSB42AA9IPZT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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