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TSB42AB4PGE

Texas Instruments

TSB42AB4PGE by Texas Instruments

TSB42AB4PGE by Texas Instruments is a Serial Communication Controller with 3.3V power supply, 50 MBps data transfer rate, and 27 MHz clock frequency. It is used for serial IO/communication control in applications requiring high-speed data transmission like industrial automation and networking systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,955 parts In-Stock

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2,955

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Vyrian

USA . 2,095 parts In-Stock

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2,095

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$10.873

100+ parts

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668

$10.873

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One Stop Electronics

USA . 141 parts In-Stock

1+ parts

$26.000

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141

$26.000

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Parana Technologies

USA . 959 parts In-Stock

1+ parts

$36.819

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959

$36.819

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$40.543

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1,203

$40.543

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ChromeModa Solutions

Germany . 4,065 parts In-Stock

1+ parts

$41.370

100+ parts

$33.923

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4,065

$41.370

$33.923

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$41.370

100+ parts

$39.302

1k+ parts

$37.233

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1,208

$41.370

$39.302

$37.233

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Corphita

USA . 1,397 parts In-Stock

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1,397

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Overview

Experience seamless and efficient communication with the TSB42AB4PGE by Texas Instruments. Crafted with precision and quality, this Serial Communication Controller offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers reliable data transfer at high speeds of up to 50 MBps. Trust in Texas Instruments' expertise in semiconductor manufacturing to ensure that you receive a top-notch product that meets your needs. Upgrade your system with the TSB42AB4PGE and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance provides flexibility in power supply options and ensures stable operation.

Address Bus Width: 9

The wide address bus width allows for efficient data addressing and handling, enhancing overall performance.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with common power sources and simplifies integration.

No. of Terminals: 144

The ample number of terminals offer versatile connectivity options and enable the controller to interface with various devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances space efficiency, making it suitable for compact electronic designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures energy efficiency and protection against voltage fluctuations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance allows for reliable operation even in demanding environmental conditions.

Maximum Data Transfer Rate: 50 MBps

The high data transfer rate enables fast and efficient communication, ideal for high-performance applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable functionality in various temperature settings.

Terminal Position: QUAD

The quad terminal position provides stable connections and ease of installation on the PCB.

Maximum Seated Height: 1.6 mm

The low seated height profile allows for slim and compact PCB designs, optimizing space usage.

Width: 20 mm

The compact width dimension enables easy integration into different electronic systems without occupying excessive space.

Boundary Scan: YES

The support for boundary scan technology aids in testing and debugging processes, ensuring product quality and reliability.

External Data Bus Width: 16

The wide external data bus width enhances data transfer capabilities and enables efficient communication with external devices.

Maximum Clock Frequency: 27 MHz

The high maximum clock frequency allows for fast data processing and smooth operation in real-time applications.

Length: 20 mm

The compact length dimension complements the width dimension, ensuring a space-efficient design overall.

Temperature Grade: COMMERCIAL

The commercial temperature grade specification makes the product suitable for standard commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The specific peripheral IC type indicates the product's focus on serial communication tasks, ensuring reliable and efficient data transfer.

Technology: CMOS

The CMOS technology used provides low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure soldering connections and reliable contact with the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures consistent and stable power delivery for reliable performance.

Bus Compatibility: 68000; 68020

The bus compatibility with 68000 and 68020 processors expands the product's versatility and compatibility with different systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on the PCB, accommodating more functionality within a limited space.

Technical Specifications

Serial Communication Controllers TSB42AB4PGE attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

9

Boundary Scan:

YES

Bus Compatibility:

68000; 68020

Maximum Clock Frequency:

27 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

TSB42AB4PGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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