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TSB41BA3BPFPG4

Texas Instruments

TSB41BA3BPFPG4 by Texas Instruments

TSB41BA3BPFPG4 by Texas Instruments is a Serial Communication Controller with 80 terminals, operating at 0-70°C. It supports IEEE1394 protocol, offers 50 MBps data transfer rate, and has a max clock frequency of 49.152 MHz. Ideal for applications requiring high-speed serial communication in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,558 parts In-Stock

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Digiode

USA . 3,988 parts In-Stock

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QIE Inc.

USA . 165 parts In-Stock

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Euro-Tech

UK . 79 parts In-Stock

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One Stop Electronics

USA . 1,391 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 834 parts In-Stock

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Parana Technologies

USA . 1,743 parts In-Stock

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DigiPath Technology Company

USA . 2,096 parts In-Stock

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$75.264

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$69.243

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ChromeModa Solutions

Germany . 3,834 parts In-Stock

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$76.800

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$62.976

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IDEA Electronic Components Group

UK . 501 parts In-Stock

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$76.800

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$72.960

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$69.120

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501

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QUARKTWIN TECHNOLOGY LTD

USA . 21,826 parts In-Stock

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Corphita

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Microchip USA

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Overview

Discover the TSB41BA3BPFPG4 by Texas Instruments, a top-quality Serial Communication Controller designed to elevate your communication systems. With a robust package body material and advanced technology, this product offers unparalleled reliability and performance. Whether you're in need of fast data transfer rates or seamless serial I/O communication, this controller delivers it all. Trust in Texas Instruments' reputation for excellence and unlock a world of possibilities with the TSB41BA3BPFPG4. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components, making this product reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2 V

Operates efficiently within a safe voltage range, ensuring reliable performance and preventing damage from overvoltage.

Address Bus Width: 2

Supports efficient communication between multiple devices, enabling seamless data transfer and control.

Package Shape: SQUARE

Square shape design facilitates easy placement and orientation on the PCB, optimizing space utilization and simplifying layout design.

No. of Terminals: 80

Provides ample connectivity options for interfacing with other components, peripherals, and external devices, enhancing versatility and functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Various package styles offer flexibility in application and integration, catering to different design requirements and preferences.

Minimum Supply Voltage: 1.7 V

Works efficiently with low voltage input, reducing power consumption and enabling operation in energy-efficient systems.

Maximum Operating Temperature: 70 °C

Withstands high temperatures without compromising performance, ensuring reliability in demanding operating environments.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate enables fast and efficient communication, making this product suitable for applications requiring quick data exchange.

Minimum Operating Temperature: 0 °C

Operates effectively in low-temperature environments, ensuring consistent performance in a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold finish provides corrosion resistance and reliable electrical connections, enhancing the overall durability and longevity of the product.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections, reducing the risk of signal interference and ensuring reliable data transmission.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and slim designs, making this product suitable for space-constrained applications.

Width: 12 mm

Compact width size facilitates easy integration into various system designs, optimizing PCB layout and space utilization.

External Data Bus Width: 8

Supports faster data transfer between external devices, enhancing system performance and responsiveness.

Communication Protocol: IEEE1394

Utilizes IEEE1394 communication protocol for reliable and high-speed data transmission, ensuring compatibility with a wide range of devices and systems.

Maximum Clock Frequency: 49.152 MHz

High clock frequency enables rapid data processing and communication, making this product suitable for high-performance applications.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly processes, ensuring durable and secure solder joints.

Length: 12 mm

Compact length size allows for flexible placement and integration, accommodating various system layouts and design constraints.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard environmental conditions, making this product suitable for commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed as a serial communication controller for efficient data exchange and control interface, enhancing the connectivity and functionality of the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and easy assembly, ensuring reliable electrical contact and mechanical stability.

Nominal Supply Voltage: 1.85 V

Operates at a nominal supply voltage for optimal performance and efficiency, ensuring stable operation in a variety of applications.

No. of Serial I/Os: 3

Multiple serial I/Os enable versatile connectivity options for interfacing with external devices and peripherals, enhancing the functionality and utility of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact layout designs and high-density packaging, optimizing space utilization on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard handling practices during assembly and storage to maintain product reliability.

Low Power Mode: YES

Low power mode feature enables energy-saving operations, prolonging battery life and reducing overall power consumption for enhanced efficiency.

Technical Specifications

Serial Communication Controllers TSB41BA3BPFPG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

49.152 MHz

Communication Protocol:

IEEE1394

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

3

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TSB41BA3BPFPG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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